NTD3055L170 ON Semiconductor, NTD3055L170 Datasheet - Page 7
NTD3055L170
Manufacturer Part Number
NTD3055L170
Description
MOSFET N-CH 60V 9A DPAK
Manufacturer
ON Semiconductor
Datasheet
1.NTD3055L170T4G.pdf
(8 pages)
Specifications of NTD3055L170
Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Logic Level Gate
Rds On (max) @ Id, Vgs
170 mOhm @ 4.5A, 5V
Drain To Source Voltage (vdss)
60V
Current - Continuous Drain (id) @ 25° C
9A
Vgs(th) (max) @ Id
2V @ 250µA
Gate Charge (qg) @ Vgs
10nC @ 5V
Input Capacitance (ciss) @ Vds
275pF @ 25V
Power - Max
1.5W
Mounting Type
Surface Mount
Package / Case
DPak, TO-252 (2 leads+tab), SC-63
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
NTD3055L170-1G
Manufacturer:
ON
Quantity:
12 500
Company:
Part Number:
NTD3055L170T4G
Manufacturer:
ON
Quantity:
12 500
Part Number:
NTD3055L170T4G
Manufacturer:
ON/安森美
Quantity:
20 000
V
S
F
1
B
R
G
4
2
3
L
A
K
D
2 PL
0.13 (0.005)
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
H
0.228
J
5.80
M
C
T
−T−
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
E
0.244
6.20
SEATING
PLANE
U
http://onsemi.com
CASE 369C−01
ISSUE C
DPAK
0.101
2.58
7
0.118
3.0
0.063
1.6
SCALE 3:1
6.172
0.243
Z
inches
mm
NOTES:
1. DIMENSIONING AND TOLERANCING
2. CONTROLLING DIMENSION: INCH.
PER ANSI Y14.5M, 1982.
STYLE 2:
DIM
G
A
B
C
D
E
F
H
K
L
R
S
U
V
Z
PIN 1. GATE
J
2. DRAIN
3. SOURCE
4. DRAIN
0.235
0.250
0.086
0.027
0.018
0.037
0.034
0.018
0.102
0.180
0.025
0.020
0.035
0.155
MIN
0.180 BSC
0.090 BSC
INCHES
0.245
0.265
0.094
0.035
0.023
0.045
0.040
0.023
0.114
0.215
0.040
0.050
MAX
−−−
−−−
MILLIMETERS
5.97
6.35
2.19
0.69
0.46
0.94
0.87
0.46
2.60
4.57
0.63
0.51
0.89
3.93
MIN
4.58 BSC
2.29 BSC
MAX
6.22
6.73
2.38
0.88
0.58
1.14
1.01
0.58
2.89
5.45
1.01
1.27
−−−
−−−