NE552R479A-T1-A CEL, NE552R479A-T1-A Datasheet - Page 8

• Manufacturer Part Number: NE552R479A-T1-A
• Description: MOSFET LD N-CHAN 3V 79A
• Manufacturer: CEL

Specifications of NE552R479A-T1-A

• Transistor Type: N-Channel
• Frequency: 2.45GHz
• Gain: 11dB
• Voltage - Rated: 15V
• Current Rating: 300mA
• Current - Test: 200mA
• Voltage - Test: 3V
• Power - Output: 26dBm
• Package / Case: 79A
• Transistor Polarity: N-Channel
• Drain-source Breakdown Voltage: 15 V
• Gate-source Breakdown Voltage: 5 V
• Continuous Drain Current: 300 mA
• Power Dissipation: 10 W
• Mounting Style: SMD/SMT
• Forward Transconductance Gfs (max / Min): 0.4 S
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Noise Figure: -
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant

RECOMMENDED SOLDERING CONDITIONS
Life Support Applications
These NEC products are not intended for use in life support devices, appliances, or systems where the malfunction of these products can reasonably
be expected to result in personal injury. The customers of CEL using or selling these products for use in such applications do so at their own risk and
agree to fully indemnify CEL for all damages resulting from such improper use or sale.
Infrared Reflow
VPS
Wave Soldering
Partial Heating
This product should be soldered and mounted under the following recommended conditions. For soldering methods
and conditions other than those recommended below, contact your nearby sales office.
Soldering Method
Caution Do not use different soldering methods together (except for partial heating).
Peak temperature (package surface temperature)
Time at peak temperature
Time at temperature of 220°C or higher
Preheating time at 120 to 180°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (package surface temperature)
Time at temperature of 200°C or higher
Preheating time at 120 to 150°C
Maximum number of reflow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (molten solder temperature)
Time at peak temperature
Preheating temperature (package surface temperature) : 120°C or below
Maximum number of flow processes
Maximum chlorine content of rosin flux (% mass)
Peak temperature (pin temperature)
Soldering time (per pin of device)
Maximum chlorine content of rosin flux (% mass)
Soldering Conditions
: 260°C or below
: 10 seconds or less
: 60 seconds or less
: 120±30 seconds
: 3 times
: 0.2%(Wt.) or below
: 215°C or below
: 25 to 40 seconds
: 30 to 60 seconds
: 3 times
: 0.2%(Wt.) or below
: 260°C or below
: 10 seconds or less
: 1 time
: 0.2%(Wt.) or below
: 350°C or below
: 3 seconds or less
: 0.2%(Wt.) or below
A Business Partner of NEC Com p ound Semiconductor Devices, Ltd .
Condition Symbol
HS350-P3
WS260
VP215
IR260
08/11/2003