HSDL-3201-008 Lite-On Electronics, HSDL-3201-008 Datasheet - Page 12

• Manufacturer Part Number: HSDL-3201-008
• Description: IRDA TX/RX 0.1152Mbps 3.3V 8-Pin Ultra Small Profile T/R
• Manufacturer: Lite-On Electronics
• Type: TX/RXr

Specifications of HSDL-3201-008

• Package: 8Ultra Small Profile
• Maximum Communication Distance: 30 cm
• Half Intensity Angle Degrees: 60(Max)/30(Min) °
• Maximum Data Rate: 0.1152 Mbps
• Peak Wavelength: 875/880 nm
• Pulse Width: 1.6/2.45 us
• Radiant Intensity: 9 mW/sr
• Operating Supply Voltage: 2.7 to 3.6 V

Appendix A: HSDL-3201#021
SMT Assembly Application Note
Solder Pad, Mask, and Metal Stencil
Recommended Metal Solder
Stencil Aperture
It is recommended that only a 0.127
mm (0.005 inches) or a 0.11 mm (0.004
inches) thick stencil be used for solder
paste printing. This is to ensure
adequate printed solder paste volume
and no shorting. See the table below
the drawing for combinations of metal
stencil aperture and metal stencil
thickness that should be used.
Aperture opening for shield pad is 2.7
mm x 1.25 mm as per land pattern.
12
APERTURE
STENCIL
SOLDER
MASK
Stencil Thickness, t (mm)
0.127 mm
0.11 mm
LAND
PATTERN
l
APERTURES AS PER
LAND DIMENSIONS
METAL STENCIL
FOR SOLDER PASTE
PRINTING
PCB
length, l
1.75
2.4
0.05
0.05
Aperture Size (mm)
w
width, w
0.55
0.55
0.05
0.05
t