TC1411CPA Microchip Technology, TC1411CPA Datasheet - Page 10

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TC1411CPA

Manufacturer Part Number
TC1411CPA
Description
MOSFET DRVR 1A 1-OUT Lo Side Inv 8-Pin PDIP Tube
Manufacturer
Microchip Technology
Type
Microcontrollerr
Datasheets

Specifications of TC1411CPA

Package
8PDIP
Driver Configuration
Inverting
Driver Type
Low Side
Peak Output Current
1(Typ) A
Input Logic Compatibility
CMOS|TTL
Number Of Outputs
1
Output Resistance
8 Ohm
Maximum Rise Time
35 ns
Maximum Power Dissipation
730 mW
Maximum Supply Current
0.5(Typ) mA
Operating Temperature
0 to 70 °C
Configuration
Low-Side
Input Type
Inverting
Delay Time
30ns
Current - Peak
1A
Number Of Configurations
1
Voltage - Supply
4.5 V ~ 16 V
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
Rise Time
35 ns
Fall Time
35 ns
Supply Voltage (min)
4.5 V
Supply Current
1 mA
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
Minimum Operating Temperature
0 C
Number Of Drivers
1
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
High Side Voltage - Max (bootstrap)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TC1411CPA
Manufacturer:
TELCOM
Quantity:
20 000
TC1411/TC1411N
8-Lead Plastic Micro Small Outline Package (UA) (MSOP)
DS21390D-page 10
c
Number of Pins
Pitch
Overall Height
Molded Package Thickness
Standoff
Overall Width
Molded Package Width
Overall Length
Foot Length
Footprint (Reference)
Foot Angle
Lead Thickness
Lead Width
Mold Draft Angle Top
Mold Draft Angle Bottom
* Controlling Parameter
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010" (0.254mm) per side.
BSC: Basic Dimension. Theoretically exact value shown without tolerances.
REF: Reference Dimension, usually without tolerance, for information purposes only.
JEDEC Equivalent: MO-187
Drawing No. C04-111
p
B
See ASME Y14.5M
See ASME Y14.5M
n
β
F
Dimension Limits
E1
E
Units
A2
E1
A1
n
p
E
D
L
F
φ
B
α
A
c
β
MIN
.030
.000
.016
.003
.009
-
L
.026 BSC
.193 BSC
.118 BSC
.118 BSC
.037 REF
2
1
Note:
INCHES
NOM
D
φ
.033
.024
.006
.012
-
-
-
-
-
8
For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
MAX
A1
A
.043
.037
.006
.016
.009
.031
15°
15°
MIN
0.75
0.00
0.40
0.08
0.22
© 2006 Microchip Technology Inc.
-
MILLIMETERS*
0.65 BSC
4.90 BSC
3.00 BSC
3.00 BSC
0.95 REF
NOM
Revised 07-21-05
0.85
0.60
α
-
-
-
-
-
-
-
8
MAX
1.10
0.95
0.15
0.80
0.23
0.40
A2
15°
15°

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