TC1411CPA Microchip Technology, TC1411CPA Datasheet - Page 11

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TC1411CPA

Manufacturer Part Number
TC1411CPA
Description
MOSFET DRVR 1A 1-OUT Lo Side Inv 8-Pin PDIP Tube
Manufacturer
Microchip Technology
Type
Microcontrollerr
Datasheets

Specifications of TC1411CPA

Package
8PDIP
Driver Configuration
Inverting
Driver Type
Low Side
Peak Output Current
1(Typ) A
Input Logic Compatibility
CMOS|TTL
Number Of Outputs
1
Output Resistance
8 Ohm
Maximum Rise Time
35 ns
Maximum Power Dissipation
730 mW
Maximum Supply Current
0.5(Typ) mA
Operating Temperature
0 to 70 °C
Configuration
Low-Side
Input Type
Inverting
Delay Time
30ns
Current - Peak
1A
Number Of Configurations
1
Voltage - Supply
4.5 V ~ 16 V
Mounting Type
Through Hole
Package / Case
8-DIP (0.300", 7.62mm)
Rise Time
35 ns
Fall Time
35 ns
Supply Voltage (min)
4.5 V
Supply Current
1 mA
Maximum Operating Temperature
+ 70 C
Mounting Style
Through Hole
Minimum Operating Temperature
0 C
Number Of Drivers
1
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
High Side Voltage - Max (bootstrap)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TC1411CPA
Manufacturer:
TELCOM
Quantity:
20 000
8-Lead Plastic Dual In-line (PA) – 300 mil (PDIP)
© 2006 Microchip Technology Inc.
* Controlling Parameter
§ Significant Characteristic
Notes:
Dimensions D and E1 do not include mold flash or protrusions. Mold flash or protrusions shall not exceed .010” (0.254mm) per side.
JEDEC Equivalent: MS-001
Drawing No. C04-018
Number of Pins
Pitch
Top to Seating Plane
Molded Package Thickness
Base to Seating Plane
Shoulder to Shoulder Width
Molded Package Width
Overall Length
Tip to Seating Plane
Lead Thickness
Upper Lead Width
Lower Lead Width
Overall Row Spacing
Mold Draft Angle Top
Mold Draft Angle Bottom
n
β
eB
E1
E
Dimension Limits
§
Units
2
1
A2
E1
B1
eB
A1
A
E
D
L
B
n
p
c
α
β
c
D
MIN
.140
.115
.015
.300
.240
.360
.125
.008
.045
.014
.310
5
5
INCHES*
NOM
A
Note:
8
A1
.100
.155
.130
.313
.250
.373
.130
.012
.058
.018
.370
10
10
B1
B
MAX
For the most current package drawings, please
see the Microchip Packaging Specification located
at http://www.microchip.com/packaging
.170
.145
.325
.260
.385
.135
.015
.070
.022
.430
15
15
TC1411/TC1411N
MIN
3.56
2.92
0.38
6.10
9.14
3.18
0.20
1.14
0.36
7.87
7.62
5
5
MILLIMETERS
NOM
8
α
2.54
3.94
3.30
7.94
6.35
9.46
3.30
0.29
1.46
0.46
9.40
10
10
p
A2
MAX
10.92
L
4.32
3.68
8.26
6.60
9.78
3.43
0.38
1.78
0.56
15
15
DS21390D-page 11

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