107587198 Lineage Power, 107587198 Datasheet - Page 13

• Manufacturer Part Number: 107587198
• Description: Module DC-DC 1-OUT 15V 2A 30W 9-Pin
• Manufacturer: Lineage Power
• Type: Step Downr

Specifications of 107587198

• Output Current: 2 A
• Output Voltage: 15 V
• Input Voltage: 24 V
• Number Of Outputs: 1
• Output Power: 30 W

Data Sheet
March 2008
Thermal Considerations
Heat Sink Selection
Several heat sinks are available for these modules.
The case includes through threaded mounting holes
allowing attachment of heat sinks or cold plates from
either side of the module. The mounting torque must
not exceed 0.56 N-m (5 in.-lb).
Figure 25 shows the case-to-ambient thermal resis-
tance, θ (°C/W), for these modules. These curves can
be used to predict which heat sink will be needed for a
particular environment. For example, if the unit dissi-
pates 7.1 W of heat in an 80 °C environment with an
airflow of 0.5 ms
sink required can be determined as follows:
where:
From Figure 25, the 1/2 in. high heat sink or greater is
required.
Figure 25. Case-to-Ambient Thermal Resistance
Lineage Power
8
7
6
5
4
3
2
1
0
T
0
c, max
P
T
θ
D
A
vs. Air Velocity Curves; Either
Orientation
θ
(100)
0.51
≤
=
=
=
=
(
θ ð (100 – 80)/7.1
θ ð 2.8 °C/W
T
–1
C max
AIR VELOCITY, ms
,
(100 ft./min.), the minimum heat
module's total thermal resistance
case temperature (See Figure 20.)
inlet ambient temperature
(See Figure 20.)
power dissipation
(200)
1.02
–
T
A
) P
(300)
1.52
⁄
NO HEAT SINK
1/4 in. HEAT SINK
1/2 in. HEAT SINK
1 in. HEAT SINK
D
–1
(continued)
(ft./min.)
(400)
2.03
(500)
2.54
8-1157(C).c
(600)
CC030-Series Power Modules; dc-dc Converters:
3.05
Although the previous example uses 100 °C as the
maximum case temperature, for extremely high-reliabil-
ity applications, one can use a lower temperature for
T
It is important to point out that the thermal resistances
shown in Figure 25 are for heat transfer from the sides
and bottom of the module as well as the top side with
the attached heat sink; therefore, the case-to-ambient
thermal resistances shown will generally be lower than
the resistance of the heat sink by itself. The data in Fig-
ure 25 was taken with a thermally conductive dry pad
between the case and the heat sink to minimize contact
resistance (typically 0.1 °C/W to 0.3 °C/W).
For a more detailed explanation of thermal energy
management for this series of power modules as well
as more details on available heat sinks, please request
the following technical note: Thermal Energy Manage-
ment CC-, CW-, DC-, and DW-Series 25 W to 30 W
Board-Mounted Power Modules (TN97-015EPS).
Layout Considerations
Copper paths must not be routed beneath the power
module standoffs.
c, max
.
18 Vdc to 36 Vdc Inputs, 30 W
13