XC2V3000-4FGG676C Xilinx Inc, XC2V3000-4FGG676C Datasheet - Page 211
XC2V3000-4FGG676C
Manufacturer Part Number
XC2V3000-4FGG676C
Description
FPGA Virtex-II™ Family 3M Gates 32256 Cells 650MHz 0.15um/0.12um (CMOS) Technology 1.5V 676-Pin FBGA
Manufacturer
Xilinx Inc
Series
Virtex™-IIr
Datasheet
1.XC2V250-4FGG256C.pdf
(318 pages)
Specifications of XC2V3000-4FGG676C
Package
676FBGA
Family Name
Virtex-IIÂ
Device Logic Units
32256
Device System Gates
3000000
Number Of Registers
28672
Maximum Internal Frequency
650 MHz
Typical Operating Supply Voltage
1.5 V
Maximum Number Of User I/os
484
Ram Bits
1769472
Number Of Labs/clbs
3584
Total Ram Bits
1769472
Number Of I /o
484
Number Of Gates
3000000
Voltage - Supply
1.425 V ~ 1.575 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
676-BBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Logic Elements/cells
-
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
122-1354
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XC2V3000-4FGG676C
Manufacturer:
XILINX
Quantity:
1 831
Company:
Part Number:
XC2V3000-4FGG676C
Manufacturer:
Xilinx Inc
Quantity:
10 000
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Virtex-II Platform FPGAs: Pinout Information
FF896 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm pitch)
Figure 7: FF896 Flip-Chip Fine-Pitch BGA Package Specifications
FF1152 Flip-Chip Fine-Pitch BGA Package
As shown in
Table
12, XC2V3000, XC2V4000, XC2V6000, and XC2V8000 Virtex-II devices are available in the FF1152
flip-chip fine-pitch BGA package. Pins in each of these devices are the same, except for the pin differences in the XC2V3000
www.xilinx.com
DS031-4 (v3.5) November 5, 2007
Module 4 of 4
Product Specification
119
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