BCX52-10,115 NXP Semiconductors, BCX52-10,115 Datasheet - Page 3

• Manufacturer Part Number: BCX52-10,115
• Description: TRANSISTOR PNP 60V 1A SOT89
• Manufacturer: NXP Semiconductors

Specifications of BCX52-10,115

• Package / Case: SC-62, SOT-89, TO-243 (3 Leads + Tab)
• Mounting Type: Surface Mount
• Power - Max: 1.3W
• Current - Collector (ic) (max): 1A
• Voltage - Collector Emitter Breakdown (max): 60V
• Transistor Type: PNP
• Frequency - Transition: 145MHz
• Dc Current Gain (hfe) (min) @ Ic, Vce: 63 @ 150mA, 2V
• Vce Saturation (max) @ Ib, Ic: 500mV @ 50mA, 500mA
• Minimum Operating Temperature: - 65 C
• Configuration: Single Dual Collector
• Transistor Polarity: PNP
• Mounting Style: SMD/SMT
• Collector- Emitter Voltage Vceo Max: 60 V
• Emitter- Base Voltage Vebo: 5 V
• Maximum Dc Collector Current: 1 A
• Power Dissipation: 1300 mW
• Maximum Operating Frequency: 145 MHz
• Maximum Operating Temperature: + 150 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Collector Cutoff (max): -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 933663050115::BCX52-10 T/R::BCX52-10 T/R

NXP Semiconductors
3. Ordering information
4. Marking
BCP52_BCX52_BC52PA
Product data sheet
Table 4.
[1]
Table 5.
Type number
BCP52
BCX52
BC52PA
Type number
BCP52
BCP52-10
BCP52-16
BCX52
BCX52-10
BCX52-16
BC52PA
BC52-10PA
BC52-16PA
Valid for all available selection groups.
Ordering information
Marking codes
[1]
All information provided in this document is subject to legal disclaimers.
Package
Name
SC-73
SC-62
HUSON3 plastic thermal enhanced ultra thin small outline
Rev. 9 — 18 October 2011
plastic surface-mounted package with increased
heatsink; 4 leads
plastic surface-mounted package; exposed die pad for
good heat transfer; 3 leads
package; no leads; 3 terminals; body 2  2  0.65 mm
Description
BCP52; BCX52; BC52PA
Marking code
BCP52
BCP52/10
BCP52/16
AE
AG
AM
BS
BT
BU
60 V, 1 A PNP medium power transistors
© NXP B.V. 2011. All rights reserved.
Version
SOT223
SOT89
SOT1061
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