M5275EVBE Freescale, M5275EVBE Datasheet - Page 19

• Manufacturer Part Number: M5275EVBE
• Manufacturer: Freescale

Specifications of M5275EVBE

• Lead Free Status / RoHS Status: Compliant

8.2
Table 8
Freescale Semiconductor
1
2
3
4
5
Junction to ambient, natural convection
Junction to ambient (@200 ft/min)
Junction to board
Junction to case
Junction to top of package
Maximum operating junction temperature
θ
recommends the use of θ
temperatures from exceeding the rated specification. System designers should be aware that device junction temperatures
can be significantly influenced by board layout and surrounding devices. Conformance to the device junction temperature
specification can be verified by physical measurement in the customer’s system using the Ψ
dissipation, and the method described in EIA/JESD Standard 51-2.
Per JEDEC JESD51-6 with the board horizontal.
Thermal resistance between the die and the printed circuit board in conformance with JEDEC JESD51-8. Board
temperature is measured on the top surface of the board near the package.
Thermal resistance between the die and the case top surface as measured by the cold plate method (MIL SPEC-883
Method 1012.1).
Thermal characterization parameter indicating the temperature difference between package top and the junction
temperature per JEDEC JESD51-2. When Greek letters are not available, the thermal characterization parameter is written
in conformance with Psi-JT.
JMA
The average chip-junction temperature (T
Where:
and Ψ
lists thermal resistance values
2
3
4
5
Thermal Characteristics
This device contains circuitry protecting against damage due to high static voltage or electrical fields;
however, it is advised that normal precautions be taken to avoid application of any voltages higher than
maximum-rated voltages to this high-impedance circuit. Reliability of operation is enhanced if unused
inputs are tied to an appropriate logic voltage level (e.g., V
Input must be current limited to the value specified. To determine the value of the required
current-limiting resistor, calculate resistance values for positive and negative clamp voltages, then use
the larger of the two values.
All functional non-supply pins are internally clamped to V
Power supply must maintain regulation within operating O V
operating maximum current conditions. If positive injection current (V
injection current may flow out of O V
regulation. Ensure the external O V
is the greatest risk when the MCU is not consuming power (ex; no clock).Power supply must maintain
regulation within operating V
jt
T
Θ
P
parameters are simulated in conformance with EIA/JESD Standard 51-2 for natural convection. Freescale
A
D
JMA
MCF5275 Integrated Microprocessor Family Hardware Specification, Rev. 4
= Ambient Temperature, °C
= Package Thermal Resistance, Junction-to-Ambient, °C/W
= P
JmA
Characteristic
INT
and power dissipation specifications in the system design to prevent device junction
+ P
I/O
DD
Table 8. Thermal characteristics
range during instantaneous and operating maximum current conditions.
Four layer board (2s2p)
Four layer board (2s2p)
Natural convection
T
J
J
DD
) in °C can be obtained from:
DD
=
load shunts current greater than maximum injection current. This
T
and could result in external power supply going out of
A
+
(
P
D
×
Θ
JMA
)
SS
(1)
SS
DD
and O V
or O V
range during instantaneous and
Symbol
θ
θ
θ
θ
Ψ
JMA
JMA
T
JB
JC
jt
j
DD
DD
in
> O V
).
.
256MBGA
DD
26
23
) is greater than I
2
105
15
10
1,5
1,2
1,2
3
4
jt
parameter, the device power
Electrical Characteristics
196MBGA
32
29
2
105
20
10
1,5
1,2
1,2
3
4
DD
, the
°C / W
°C / W
°C / W
°C / W
°C / W
Unit
o
C
19