104130-5 TE Connectivity, 104130-5 Datasheet - Page 43

• Manufacturer Part Number: 104130-5
• Description: Conn Ejector Header HDR 26 POS 2.54mm Solder RA Thru-Hole
• Manufacturer: TE Connectivity
• Type: Ejector Headerr
• Series: AMP-LATCHr

Specifications of 104130-5

• Pitch: 2.54 mm
• Number Of Rows: 2
• Number Of Contacts: 26
• Gender: HDR
• Contact Plating: Gold Over Nickel
• Termination Method: Solder
• Connector Type: Wire To Board
• Contact Termination: Right Angle Through Hole
• No. Of Contacts: 26
• No. Of Rows: 2
• Pitch Spacing: 2.54mm
• Rohs Compliant: No
• Product Line: AMP-LATCH
• Profile: Low
• Pcb Mounting Orientation: Right Angle
• Pcb Mount Retention: Without
• Mating Connector Lock: Without
• Housing Style: 4-Sided
• Ejection Latches: With
• Post Size (mm [in]): 0.64 [.025]
• Shrouded: Yes
• [shrouded] End Dimension (mm [in]): 3.81 [0.150]
• Current Rating (a): 1
• Insulation Resistance (m?): 5,000
• Termination Post Length (mm [in]): 3.43 [0.135]
• Solder Tail Contact Plating: Tin-Lead over Nickel
• Header Type: Pin Header
• Number Of Positions: 26
• Centerline, Matrix (mm [in]): 2.54 x 2.54 [.100 x .100]
• Daisy Chain: With
• Preloaded: Yes
• Contact Plating, Mating Area, Material: Gold (30), Gold Flash over Palladium Nickel
• Contact Shape: Square
• Contact Base Material: Copper Alloy
• Connector Style: Header - Pin
• Mating Alignment Type: Center, Dual Polarizing Bar
• Mating Alignment: With
• Housing Material: Thermoplastic - GF
• Ul Flammability Rating: UL 94V-0
• Housing Color: Black
• Rohs/elv Compliance: Not ELV/RoHS compliant
• Lead Free Solder Processes: Not suitable for lead free processing
• Approved Standards: UL E28476, CSA LR7189
• Operating Temperature (°c): -65 – +105
• Temperature Rating: Standard

Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Product Facts
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Surface-mount option for
parallel board-to-board
applications; completely
intermateable with
AMPMODU System 50
thru-hole board-to-board
and cable-to-board systems
Double row, vertical,
shrouded header and
receptacle assemblies
Available in select sizes
from 10 through 100
positions
High Density; contacts
spaced on .050 x .100 [1.27
x 2.54] centers; compact
footprint
Compatible with standard
surface-mount processes
Stand-offs for free drainage
of flux cleaning solutions;
visible solder joints for easy
inspection
Simple, low insertion-force
holddown for process
retention and long-term
strain relief for solder joints
Available in tape and reel
packaging (with vacuum
covers) for automatic
placement.
are metric equivalents.
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
AMPMODU Interconnection System
Surface-Mount Connectors, .050 x .100 [1.27 x 2.54] Centerline,
Board-to-Board
The high-density surface-
mount connector is another
mounting option in the
AMPMODU System 50
connector family.
This surface-mount system
is fully intermateable with
the AMPMODU System 50
thru-hole and cable-to-
board connectors.
Additionally, the design of
the mating interface has not
been changed, maintaining
the same high reliability as
the thru-hole product.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
The surface-mount system
includes double row,
vertical, shrouded header
and receptacle assemblies
in select sizes from 10
through 100 positions. It
meets the tight dimensional
requirements of surface-
mount technology. The
simple, low insertion-force
holddown provides both
processing retention and
long-term strain relief for
the solder joints in the
headers and receptacles.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
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