D10650-40 Wakefield Thermal Solutions, D10650-40 Datasheet - Page 18
![HEATSINK 100PQFP COMPOSITE](/photos/5/89/58903/d10650-40_sml.jpg)
D10650-40
Manufacturer Part Number
D10650-40
Description
HEATSINK 100PQFP COMPOSITE
Manufacturer
Wakefield Thermal Solutions
Datasheet
1.658-60ABT3.pdf
(19 pages)
Specifications of D10650-40
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Outline
16.51mm x 16.51mm
Height
0.4" (10.16mm)
Power Dissipation @ Temperature Rise
2W @ 40°C
Thermal Resistance @ Forced Air Flow
25°C/W @ 350 LFM
Product
Heatsinks
Mounting Style
Through Hole
Heatsink Material
Plastic
Fin Style
Pin
Dimensions
16.51 mm L x 10.16 mm W x 16.51 mm H
Designed For
BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
345-1076
D1065040
D1065040
ROCKER CLIP OPTION
(SEE PRODUCT DES.)
SPRING CLIP OPTION
(SEE PRODUCT DES.)
2.34
OPTIONAL THERMAL INTERFACE
PAD (SEE PRODUCT DES.)
1.00
2.68
.23
1.50
.42
1.50
100 = 1.00"
MODEL NUMBER
HEIGHT
569 - 100 XX - XX
THERMAL INTERFACE
S4 = DELTALINK IV
BLANK = NO THERMAL PAD
CLIP
AK = SPRING CLIP
14-16 Pin DIPs