D10650-40 Wakefield Thermal Solutions, D10650-40 Datasheet - Page 4
![HEATSINK 100PQFP COMPOSITE](/photos/5/89/58903/d10650-40_sml.jpg)
D10650-40
Manufacturer Part Number
D10650-40
Description
HEATSINK 100PQFP COMPOSITE
Manufacturer
Wakefield Thermal Solutions
Datasheet
1.658-60ABT3.pdf
(19 pages)
Specifications of D10650-40
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method
Thermal Tape, Adhesive (Not Included)
Outline
16.51mm x 16.51mm
Height
0.4" (10.16mm)
Power Dissipation @ Temperature Rise
2W @ 40°C
Thermal Resistance @ Forced Air Flow
25°C/W @ 350 LFM
Product
Heatsinks
Mounting Style
Through Hole
Heatsink Material
Plastic
Fin Style
Pin
Dimensions
16.51 mm L x 10.16 mm W x 16.51 mm H
Designed For
BGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Thermal Resistance @ Natural
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
345-1076
D1065040
D1065040
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, and FPBGAs
Notes:
PRODUCT FEATURES
14
12
10
8
6
4
2
0
Performance shown is with T4 thermal adhesive applied.
200
300
Approach Velocity, LFM
400
642-25-T4
642-35-T4
642-45-T4
642-60-T4
500
600