D10650-40 Wakefield Thermal Solutions, D10650-40 Datasheet - Page 8

• Manufacturer Part Number: D10650-40
• Description: HEATSINK 100PQFP COMPOSITE
• Manufacturer: Wakefield Thermal Solutions

Specifications of D10650-40

• Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
• Attachment Method: Thermal Tape, Adhesive (Not Included)
• Outline: 16.51mm x 16.51mm
• Height: 0.4" (10.16mm)
• Power Dissipation @ Temperature Rise: 2W @ 40°C
• Thermal Resistance @ Forced Air Flow: 25°C/W @ 350 LFM
• Product: Heatsinks
• Mounting Style: Through Hole
• Heatsink Material: Plastic
• Fin Style: Pin
• Dimensions: 16.51 mm L x 10.16 mm W x 16.51 mm H
• Designed For: BGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Thermal Resistance @ Natural: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 345-1076; D1065040

DELTEM
1 0 0
8 0
6 0
4 0
2 0
™
0
0
0
COMPOSITE HEAT SINKS FOR BGAs
200
0.25
HEAT DISSIPATED (WATTS)
AIR VELOCITY (LFM)
Available with pressure sensitive adhesives for quick and easy mounting. See Page 3
Available with pressure sensitive adhesives for quick and easy mounting. See Page 3
400
0.50
600
0.75
800
1.00
1000
1.25
3 0
2 5
2 0
1 5
1 0
5
0
1 0 0
8 0
6 0
4 0
2 0
0
0
0
200
0.25
HEAT DISSIPATED (WATTS)
AIR VELOCITY (LFM)
400
0.50
600
0.75
800
1.00
1000
1.25
1 6
1 4
1 2
1 0
8
6
4
2
0