MHSL10025 Lineage Power, MHSL10025 Datasheet - Page 4

• Manufacturer Part Number: MHSL10025
• Description: HEATSINK 2.28L X.84"H EXTRUSION
• Manufacturer: Lineage Power

Specifications of MHSL10025

• Attachment Method: Bolt On
• Outline: 57.91mm x 36.83mm
• Height: 0.84" (21.33mm)
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Package Cooled: -
• Power Dissipation @ Temperature Rise: -
• Thermal Resistance @ Forced Air Flow: -
• Thermal Resistance @ Natural: -

Thermal Management for FC- and FW-Series
250 W—300 W Board-Mounted Power Modules
Module Derating
Heat Sink Configuration
Several standard heat sinks are available for the FC- and FW-Series 250 W—300 W BMPMs, as shown in Figures
6 and 7. The heat sinks mount to the top surface of the module with M3 x 0.5 screws torqued to 5 in.-lb. (0.56 N-m).
Placing a thermally conductive dry pad or thermal grease between the case and the heat sink minimizes contact
resistance (typically 0.1 °C/W to 0.3 °C/W) and temperature drop. All heat sink curve data taken had such a dry
pad present.
4
(continued)
2.36
Figure 6. Heat Sinks with Longitudinal Fins
4.56
1/4 IN. (MHSL02555)
1/2 IN. (MHSL05055)
1 IN. (MHSL10055)
1 1/2 IN. (MHSL15055)
Tyco Electronics Corp.
Technical Note
July 1996
8-1316