5962-8953202QA QP SEMICONDUCTOR, 5962-8953202QA Datasheet - Page 3

• Manufacturer Part Number: 5962-8953202QA
• Manufacturer: QP SEMICONDUCTOR

Specifications of 5962-8953202QA

• Lead Free Status / RoHS Status: Not Compliant

DSCC FORM 2234
APR 97
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a
specific exemption has been obtained.
JAN class level B devices and as specified herein. Product built to this drawing that is produced by a Qualified Manufacturer
Listing (QML) certified and qualified manufacturer or a manufacturer who has been granted transitional certification to MIL-
PRF-38535 may be processed as QML product in accordance with the manufacturers approved program plan and qualifying
activity approval in accordance with MIL-PRF-38535. This QML flow as documented in the Quality Management (QM) plan
may make modifications to the requirements herein. These modifications shall not affect form, fit, or function of the device.
These modifications shall not affect the PIN as described herein. A "Q" or "QML" certification mark in accordance with MIL-
PRF-38535 is required to identify when the QML flow option is used.
in MIL-PRF-38535, appendix A and herein.
as specified in table I and shall apply over the full case operating temperature range.
tests for each subgroup are described in table I.
in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN
number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device.
3. REQUIREMENTS
3.1 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535, appendix A for non-
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified
3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.2 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Functional block diagram. The functional block diagram shall be as specified on figure 3.
3.2.4 Timing waveforms and test circuits. The timing waveforms and test circuits shall be as specified on figure 3.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
3.5 Marking. Marking shall be in accordance with MIL-PRF-38535, appendix A. The part shall be marked with the PIN listed
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text
DEPARTMENT OF DEFENSE SPECIFICATION
DEPARTMENT OF DEFENSE STANDARDS
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-PRF-38535 -
MIL-STD-883
MIL-STD-1835
MIL-HDBK-103
MIL-HDBK-780
(Copies of these documents are available online at
DEFENSE SUPPLY CENTER COLUMBUS
MICROCIRCUIT DRAWING
COLUMBUS, OHIO 43218-3990
STANDARD
-
-
-
-
Standard Microcircuit Drawings.
Integrated Circuits, Manufacturing, General Specification for.
Test Method Standard Microcircuits.
Interface Standard Electronic Component Case Outlines.
List of Standard Microcircuit Drawings.
http://assist.daps.dla.mil/quicksearch/
SIZE
A
REVISION LEVEL
C
or
http://assist.daps.dla.mil
SHEET
5962-89532
3
or