SST39VF1601C-70-4C-B3KE-T Microchip Technology, SST39VF1601C-70-4C-B3KE-T Datasheet - Page 32

• Manufacturer Part Number: SST39VF1601C-70-4C-B3KE-T
• Description: 2.7V To 3.6V 16Mbit Multi-Purpose Flash 48 TFBGA 6x8x1.2 Mm T/R
• Manufacturer: Microchip Technology

Specifications of SST39VF1601C-70-4C-B3KE-T

• Format - Memory: FLASH
• Memory Type: FLASH
• Memory Size: 16M (1M x 16)
• Speed: 70ns
• Interface: Parallel
• Voltage - Supply: 2.7 V ~ 3.6 V
• Operating Temperature: 0°C ~ 70°C
• Package / Case: 48-TFBGA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Data Sheet
©2010 Silicon Storage Technology, Inc.
FIGURE 28: 48-ball Thin-profile, Fine-pitch Ball Grid Array (TFBGA) 6mm x 8mm
FIGURE 29: 48-ball Very, Very Thin-profile, Fine-pitch Ball Grid Array (WFBGA) 6mm x 8mm
Note:
6
5
4
3
2
1
A1 CORNER
1. Complies with JEDEC Publication 95, MO-210, variant 'AB-1', although some dimensions may be more stringent.
2. All linear dimensions are in millimeters.
3. Coplanarity: 0.12 mm
4. Ball opening size is 0.38 mm (± 0.05 mm)
Note:
SST Package Code: B3K
SST Package Code: MAQ
6
5
4
3
2
1
A B C D E F G H
A1 CORNER
SEATING PLANE
A B C D E F G H J K L
SEATING PLANE
SIDE VIEW
TOP VIEW
1. Complies with JEDEC Publication 95, MO-207, Variant CB-4 except nominal ball size is larger
2. All linear dimensions are in millimeters.
3. Coplanarity: 0.08 mm
4. Ball opening size is 0.29 mm (± 0.05 mm)
8.00 ± 0.20
DETAIL
TOP VIEW
and bottom side A1 indicator is triangle at corner.
± 0.08
6.00
0.35 ± 0.05
± 0.08
0.20 ± 0.06
6.00 ± 0.20
1.10 ± 0.10
4.00
0.73 max.
0.636 nom.
0.08
0.12
32
4.00
0.80
0.50
2.50
BOTTOM VIEW
H G F E D C B A
L K J H G F E D C B A
16 Mbit Multi-Purpose Flash Plus
SST39VF1601C / SST39VF1602C
SIDE VIEW
BOTTOM VIEW
5.00
A1 INDICATOR
5.60
0.50
0.80
48-wfbga-MAQ-4x6-32mic-2.0
6
5
4
3
2
1
0.32 ± 0.05
(48X)
A1 CORNER
6
5
4
3
2
1
48-tfbga-B3K-6x8-450mic-4
1mm
0.45 ± 0.05
(48X)
1mm
S71380-04-000
05/10