ISP1104W STEricsson, ISP1104W Datasheet

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IMPORTANT NOTICE Dear customer from August 2 2008, the wireless operations of NXP have moved to a new company, ST-NXP Wireless result, the following changes are applicable to the attached document. ● Company name - Philips ...

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ISP1104 Advanced Universal Serial Bus transceiver Rev. 02 — 14 October 2003 1. General description The ISP1104 Universal Serial Bus (USB) transceiver is compliant with the Universal Serial Bus Specification Rev. 2.0 . The ISP1104 can transmit and receive USB ...

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... Philips Semiconductors 4. Ordering information Table 1: Type number ISP1104W 5. Block diagram (1) Pin function depends on the device function, see Fig 1. Block diagram. 9397 750 11229 Product data Ordering information Package Name Description HBCC16 plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 3 CC(I/O) ...

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... Philips Semiconductors 6. Pinning information 6.1 Pinning Fig 2. Pin configuration HBCC16. 6.2 Pin description Table 2: Symbol OE RCV VP VM 9397 750 11229 Product data 6 SUSPND ISP1104W 3 VP GND 2 RCV (exposed diepad Bottom view Pin description [1] Pin Type Description 1 I input for output enable (CMOS level with respect active LOW) ...

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Philips Semiconductors Table 2: Symbol SUSPND MODE V CC(I/O) VBUSDET D D VPO/VO VMO/FSE0 V reg(3.3) V CC(5.0) V pu(3.3) SOFTCON GND [1] Symbol names with an overscore (for example, NAME) indicate active LOW signals. 9397 750 11229 Product data ...

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Philips Semiconductors 7. Functional description 7.1 Function selection Table 3: SUSPND [1] Signal levels on pins D and D are determined by other USB devices and external pull-up or pull-down resistors. [2] In the suspend ...

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Philips Semiconductors 7.3 Power supply configurations The ISP1104 can be used with different power supply configurations, which can be changed dynamically. Normal mode — Both V V CC(5.0) then produces 3.3 V for USB connections. V voltage source (1.65 V ...

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Philips Semiconductors 8. Electrostatic discharge (ESD) 8.1 ESD protection The pins that are connected to the USB connector (D minimum ESD protection. The 12 kV measurement is limited by the test equipment. Capacitors of ...

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Philips Semiconductors 9. Limiting values Table 9: Absolute maximum ratings In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage CC(5.0) V I/O supply voltage CC(I/ input voltage I I latch-up current lu ...

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Philips Semiconductors Table 11: Static characteristics: supply pins CC(5.0) CC(I/O) Symbol Parameter I sharing mode load current on Dx(sharing) pins D and D V supply ...

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Philips Semiconductors Table 12: Static characteristics: digital pins CC(I/O) GND Symbol Parameter V HIGH-level output voltage OH Example 2.5 V 0.2 V CC(I/O) Input levels ...

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Philips Semiconductors Table 13: Static characteristics: analog I/O pins D and 4 5 CC(5.0) GND Symbol Parameter Capacitance C transceiver capacitance IN Resistance Z driver output impedance DRV Z ...

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Philips Semiconductors Table 14: Dynamic characteristics: analog I/O pins D and CC(5.0) CC(I/O) specified. Symbol Parameter t driver enable delay PZH ( ...

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Philips Semiconductors 13. Test information Load capacitance C Fig 8. Load on pins D and for Fig 9. Load on pins D and D for enable and disable times. Fig ...

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Philips Semiconductors 14. Package outline HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 0.65 mm terminal 1 index area 1 1 DIMENSIONS (mm are the ...

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... Philips Semiconductors 15. Packaging The ISP1104W (HBCC16 package) is delivered on a type A carrier tape, see Figure The reel diameter is 330 mm. The reel is made of polystyrene (PS) and is not designed for use in a baking process. The cumulative tolerance of 10 successive sprocket holes is 0.02 mm. The camber must not exceed 100 mm. ...

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Philips Semiconductors 16. Additional soldering information 16.1 (H)BCC packages: footprint The surface material of the terminals on the resin protrusion consists of a 4-layer metal structure (Au, Pd, Ni and Pd). The layer (0.1 m min.) ensures ...

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Philips Semiconductors 17. Revision history Table 16: Revision history Rev Date CPCN Description 02 20031014 - Product data (9397 750 11229) Modifications: • Changed USB 1.1 reference to USB 2.0; also added data transfer rates • Section • Figure • ...

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Philips Semiconductors 18. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualification III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...

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Philips Semiconductors Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . ...