ISP1104W STEricsson, ISP1104W Datasheet - Page 17

• Manufacturer Part Number: ISP1104W
• Manufacturer: STEricsson

Specifications of ISP1104W

• Lead Free Status / RoHS Status: Supplier Unconfirmed

Philips Semiconductors
16. Additional soldering information
9397 750 11229
Product data
Fig 13. (H)BCC footprint and solder resist mask dimensions.
Cavity: exposed die pad, either functioning as heatsink or as ground connection; only for HBCC packages.
Normal
Corner
Cavity
Terminal
b 2
D h
b
b 1
16.1 (H)BCC packages: footprint
16.2 (H)BCC packages: reflow soldering profile
b 2
E h
The surface material of the terminals on the resin protrusion consists of a 4-layer
metal structure (Au, Pd, Ni and Pd). The Au + Pd layer (0.1 m min.) ensures
solderability, the Ni layer (5 m min.) prevents diffusion, and the Pd layer on top
(0.5 m min.) ensures effective wire bonding.
The conditions for reflow soldering of (H)BCC packages are as follows:
•
•
•
Preheating time: minimum 90 s at T = 145 to 155 C
Soldering time: minimum 90 s (BCC) or minimum 100 s (HBCC) at T > 183 C
Peak temperature:
PCB land
– Ambient temperature: T
– Device surface temperature: T
b 2
D h
b
b 1
b 2
E h
Rev. 02 — 14 October 2003
Solder resist mask
0.05
0.05
0.05
amb(max)
0.05
0.05
0.05
case(max)
= 260 C
(4 )
0.1
Stencil mask
0.05
= 255 C.
0.05
0.3 (8 )
0.05
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
0.05
Advanced USB transceiver
Stencil print thickness:
0.1 to 0.12 mm
All dimensions in mm
For exact dimensions
see package outline
drawing (SOT639-2)
004aaa123
Solder land
Solder resist
Solder stencil
ISP1104
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