LTC3770EUH#TR Linear Technology, LTC3770EUH#TR Datasheet - Page 22

LTC3770EUH#TR

Manufacturer Part Number
LTC3770EUH#TR
Description
Manufacturer
Linear Technology
Datasheet

Specifications of LTC3770EUH#TR

Lead Free Status / RoHS Status
Not Compliant

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LTC3770
APPLICATIONS INFORMATION
When laying out a printed circuit board, without a ground
plane, use the following checklist to ensure proper opera-
tion of the controller.
• Segregate the signal and power grounds. All small
• Place M2 as close to the controller as possible, keeping
• Connect the input capacitor(s) C
TYPICAL APPLICATIONS
22
signal components should return to the SGND pin at
one point which is then tied to the PGND pin close to
the source of M2.
the PGND, BG and SW traces short.
TRACK/SS
PGOOD
RUN
C
220pF
F
R2
60.4k
R1
30.1k
R
51k
RUN
R
10k
100pF
C
CC1
1000pF
CC2
R7
47k
R8
51k
MARGIN1
MARGIN0
10k
R
100k
R
75k
R5
ON
PG
1
2
3
4
5
6
7
8
V
V
I
SGND
MARGIN1
MARGIN0
I
V
TH
ON
V
RNG
FB
REFIN
REFOUT
9
PGOOD V
IN
MPGM TRACK/SS
32
close to the power
10
R6
200k
ON
31
RUN FCB
11
30
LTC3770EUH
1.8V/5A at 450kHz with Tracking
FCB
PLLFLTR PLLIN V
29
12
Z0 BOOST TG
28
13
27
IN
14
26
V
INSNS
V
5V
SW
CC
15
• Keep the high dV/dt SW, BOOST and TG nodes away
• Connect the INTV
• Connect the top driver boost capacitor CB closely to
• Connect the V
25
SENSE+
SENSE–
INTV
DRV
PGND
ZV
MOSFETs. This capacitor carries the MOSFET AC
current.
from sensitive small-signal nodes.
to the INTV
the BOOST and SW pins.
to the V
BG
Z2
Z1
IN
CC
CC
16
24
23
22
21
20
19
18
17
IN
1000pF
and PGND pins.
CC
and PGND pins.
IN
C
C
L1: BI TECH 1.8μH HM65-H1R8-TB
M1, M2: PHILIPS PH3230
IN
OUT
pin decoupling capacitor C
CC
: TDK C4532X5R1H685M
: PANASONIC EEFUE0G181R
decoupling capacitor CV
CB
0.22μF
DB
CMDSH-3
CV
4.7μF
INTV
CC
CC
B340A
M1
PH3230
M2
PH3230
1.8μH
D1
L1
C
22μF
X5R
x2
OUT3
+
C
180μF
4V
x2
3770 TA02a
V
1.8V
5A
OUT
OUT
CC
IN
closely
closely
C
6.8μF
50V
x3
V
4V TO 28V
IN
IN
3770fc

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