S71PL064JB0BFW0B0 Spansion Inc., S71PL064JB0BFW0B0 Datasheet - Page 20
![no-image](/images/manufacturer_photos/0/6/621/spansion_inc__sml.jpg)
S71PL064JB0BFW0B0
Manufacturer Part Number
S71PL064JB0BFW0B0
Description
Manufacturer
Spansion Inc.
Datasheet
1.S71PL064JB0BFW0B0.pdf
(189 pages)
Specifications of S71PL064JB0BFW0B0
Operating Supply Voltage (max)
3.1V
Operating Temperature (max)
85C
Mounting
Surface Mount
Lead Free Status / RoHS Status
Compliant
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TSC056—56-ball Fine-Pitch Ball Grid Array (FBGA)
9 x 7mm Package
September 14, 2004 S71PL254/127/064/032J_00_A5
PACKAGE
SYMBOL
SD / SE
JEDEC
D x E
A
MD
ME
D1
eD
A1
A2
E1
φb
eE
A
D
E
n
CORNER
0.15
(2X)
PIN A1
A2
A1
C
0.17
0.81
0.35
MIN
A1,A8,D4,D5,E4,E5,H1,H8
---
56X
9.00 mm x 7.00 mm
0.15
0.08
PACKAGE
INDEX MARK
9.00 BSC.
7.00 BSC.
5.60 BSC.
5.60 BSC.
0.80 BSC.
0.40 BSC.
0.80 BSC
TSC 056
6
NOM
b
0.40
N/A
56
---
---
---
M
M
8
8
10
C
C
A B
SIDE VIEW
MAX
TOP VIEW
1.20
0.97
0.45
---
D
PROFILE
BALL HEIGHT
BODY THICKNESS
BODY SIZE
BODY SIZE
MATRIX FOOTPRINT
MATRIX FOOTPRINT
MATRIX SIZE D DIRECTION
MATRIX SIZE E DIRECTION
BALL COUNT
BALL DIAMETER
BALL PITCH
BALL PITCH
SOLDER BALL PLACEMENT
DEPOPULATED SOLDER BALLS
P r e l i m i n a r y
NOTE
C
A
0.15
(2X)
E
B
C
0.20 C
0.08
eE
C
NOTES:
1.
2.
3.
4.
5.
6
7
8.
9.
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
8
7
6
5
4
3
2
1
eD
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
ALL DIMENSIONS ARE IN MILLIMETERS.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
N/A
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
e REPRESENTS THE SOLDER BALL GRID PITCH.
H
SD
BOTTOM VIEW
G
7
F
E
D1
D C
B
A
SE
CORNER
PIN A1
7
3427 \ 16-038.22
E1
20
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