S25FL016A0LMFI011 Spansion Inc., S25FL016A0LMFI011 Datasheet - Page 35

• Manufacturer Part Number: S25FL016A0LMFI011
• Manufacturer: Spansion Inc.

Specifications of S25FL016A0LMFI011

• Cell Type: NOR
• Density: 16Mb
• Access Time (max): 10ns
• Interface Type: Serial (SPI)
• Boot Type: Not Required
• Address Bus: 1b
• Operating Supply Voltage (typ): 3/3.3V
• Operating Temp Range: -40C to 85C
• Package Type: SOIC W
• Program/erase Volt (typ): 2.7 to 3.6V
• Sync/async: Synchronous
• Operating Temperature Classification: Industrial
• Operating Supply Voltage (min): 2.7V
• Operating Supply Voltage (max): 3.6V
• Word Size: 8b
• Number Of Words: 2M
• Supply Current: 19mA
• Mounting: Surface Mount
• Pin Count: 8
• Lead Free Status / RoHS Status: Compliant

18. Revision History
February 27, 2009 S25FL016A_00_C4
Revision A (July 13, 2004)
Global
Revision A1 (September 13, 2004)
Connection Diagrams
Ordering Information Table
Revision A2 (December 16, 2004)
Read Identification (RDID)
Revision A3 (March 3, 2005)
Ordering Information
Read Identification (RDID)
Revision A4 (March 29, 2005)
DC Characteristics
Global
Revision A5 (June 21, 2005)
Distinctive Characteristics
Ordering Information
Valid Combination Table
Power-up and Power-down section
DC Characteristics
AC Characteristics
Revision A6 (December 21, 2005)
Global
Ordering Information
Valid Combination Table
Revision B0 (April 18, 2005)
Global
AC Characteristics table
Revision B1 (June 29, 2006)
DC Characteristics
Revision C0 (August 28, 2006)
Global
Revision C1 (February 16, 2007)
Global
Absolute Maximum Ratings
Revision C2 (June 29, 2007)
Device Operations
Revision C3 (January 7, 2008)
Ordering Information
Revision C4 (February 27, 2009)
Global
Section
Initial release.
Added the WSON 6x8mm pin out.
Changed OPN to reflect Device technology identification change from M to A for CS99S MirrorBit
technology.
Changed memory capacity of the device in the second byte from 14h to 15h.
Added new commercial temperature range. Updated package and temperature, and package
marking information. Added note on standard package A and Pb-free package F information.
Updated memory capacity of the device in the second byte from 15h to 14h.
Updated table.
Removed Commercial temperature range.
Updated Page Program speed. Update Deep Power Down Mode time. Update timing numbers.
Added Tray to packing type.
Updated Packing Type.
Updated this section. Removed Figure 19. Updated Table 7 Power-up Timing.
Added and updated values in Table 8.
Updated Figure 21.
Added 8-pin SO package to Distinctive Characteristics, Connection Diagram, and Ordering
Information, and Physical Dimensions sections.
Added Tray to packing type.
Updated.
Changed document status from Advance Information to Preliminary. Changed title from family of
devices to specific device.
Updated t
Changed typical and maximum specifications for I
Rewrote entire document for better flow and clarity. No specifications were changed.
Deleted Preliminary status from document.
Added overshoot and undershoot information.
Added sentence to Byte or Page Programming
Added Tray packing option for 8-pin and 16-pin SOIC packages.
Added obsolescence information to Cover Sheet, Distinctive Characteristics, and Ordering
Information sections of data sheet.
D a t a
W
specifications.
S h e e t
S25FL016A
Description
CC2
.
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