MT45W1MW16BDGB-708 IT TR Micron Technology Inc, MT45W1MW16BDGB-708 IT TR Datasheet - Page 10
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MT45W1MW16BDGB-708 IT TR
Manufacturer Part Number
MT45W1MW16BDGB-708 IT TR
Description
Manufacturer
Micron Technology Inc
Datasheet
1.MT45W1MW16BDGB-708_IT_TR.pdf
(59 pages)
Specifications of MT45W1MW16BDGB-708 IT TR
Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / RoHS Status
Compliant
Functional Description
Power-Up Initialization
Figure 4:
Bus Operating Modes
Asynchronous Mode
PDF: 09005aef81cb58ed/Source: 09005aef81c7a667
16mb_burst_cr1_0_p23z_2.fm - Rev. H 4/08 EN
Power-Up Initialization Timing
In general, the MT45W1MW16BDGB devices are high-density alternatives to SRAM and
Pseudo SRAM products, popular in low-power, portable applications.
The MT45W1MW16BDGB contains a 16,777,216-bit DRAM core organized as 1,048,576
addresses by 16 bits. This device implements the same high-speed bus interface found
on burst mode Flash products.
The CellularRAM bus interface supports both asynchronous and burst mode transfers.
Page mode accesses are also included as a bandwidth-enhancing extension to the asyn-
chronous read protocol.
CellularRAM products include an on-chip voltage sensor used to launch the power-up
initialization process. Initialization will configure the BCR and the RCR with their default
settings (see Figure 17 on page 23 and Figure 22 on page 27). V
applied simultaneously. When they reach a stable level at or above 1.7V, the device will
require 150µs to complete its self-initialization process. During the initialization period,
CE# should remain HIGH. When initialization is complete, the device is ready for
normal operation.
VccQ
The MT45W1MW16BDGB CellularRAM products incorporate a burst mode interface
found on Flash products targeting low-power, wireless applications. This bus interface
supports asynchronous, page mode, and burst mode read and write transfers. The
specific interface supported is defined by the value loaded into the bus configuration
register. Page mode is controlled by the refresh configuration register (RCR[7]).
CellularRAM products power up in the asynchronous operating mode. This mode uses
the industry-standard SRAM control bus (CE#, OE#, WE#, LB#/UB#). READ operations
(Figure 5) are initiated by bringing CE#, OE#, and LB#/UB# LOW while keeping WE#
HIGH. Valid data will be driven out of the I/Os after the specified access time has
elapsed. WRITE operations (Figure 6 on page 11) occur when CE#, WE#, and LB#/UB#
are driven LOW. During asynchronous WRITE operations, the OE# level is a “Don't
Care,” and WE# will override OE#. The data to be written is latched on the rising edge of
CE#, WE#, or LB#/UB# (whichever occurs first). Asynchronous operations (page mode
disabled) can either use the ADV input to latch the address, or ADV can be driven LOW
during the entire READ/WRITE operation.
During asynchronous operation, the CLK input must be held static LOW or HIGH. WAIT
will be driven while the device is enabled and its state should be ignored. WE# LOW time
must be limited to
Vcc
Vcc = 1.7V
16Mb: 1 Meg x 16 Async/Page/Burst CellularRAM 1.0 Memory
Device Initialization
t
CEM.
t PU > 150µs
10
Device ready for
normal operation
Micron Technology, Inc., reserves the right to change products or specifications without notice.
Functional Description
CC
©2005 Micron Technology, Inc. All rights reserved.
and V
CC
Q must be