8200801JA E2V, 8200801JA Datasheet - Page 2

• Manufacturer Part Number: 8200801JA
• Manufacturer: E2V

Specifications of 8200801JA

• Lead Free Status / RoHS Status: Supplier Unconfirmed

DSCC FORM 2234
APR 97
accordance with MIL-PRF-38535, appendix A.
1/
2/
3/
1. SCOPE
1.1 Scope. This drawing describes device requirements for MIL-STD-883 compliant, non-JAN class level B microcircuits in
1.2 Part or Identifying Number (PIN). The complete PIN is as shown in the following example:
1.2.1 Device type(s). The device type(s) identify the circuit function as follows:
1.2.2 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
1.2.3 Lead finish. The lead finish is as specified in MIL-PRF-38535, appendix A.
1.3 Absolute maximum ratings.
1.4 Recommended operating conditions.
Generic numbers are listed on the Standardized Military Drawing Source Approval Bulletin at the end of this document and
will also be listed in MIL-HDBK-103.
Heat sinking is recommended to reduce the junction temperature.
Must withstand the added P
Device type
Drawing number
Outline letter
Supply voltage (V
Input voltage range ................................................................................
Storage temperature range ...................................................................
Lead temperature (soldering, 10 seconds) ............................................
Thermal resistance, junction-to-case (
Output voltage applied ...........................................................................
Output sink current ...............................................................................
Maximum power dissipation (P
Maximum junction temperature (T
Supply voltage range (V
Minimum high level input voltage (V
Maximum low level input voltage (V
Normalized fanout (each output) ...........................................................
Case operating temperature range (T
01
02
03
04
J
K
L
X
3
Y
MICROCIRCUIT DRAWING
82008
COLUMBUS, OHIO 43218-3990
DLA LAND AND MARITIME
STANDARD
CC
Generic number 1/
) ..............................................................................
GDIP1-T24 or CDIP2-T24
GDFP2-F24 or CDFP3-F24
GDIP3-T24 or CDIP4-T24
CQCC1-N32
CQCC1-N28
CDFP4-F24
D
Device type
Descriptive designator
(see 1.2.1)
due to short circuit test (e.g., I
CC
) ....................................................................
01
D
) 3/ ......................................................
J
) .......................................................
IL
IH
) ...................................................
) ..................................................
C
) ................................................
JC
) ............................................
4096 words x 8 bits per word PROM, T.S.
4096 words x 8 bits per word PROM, T.S.
4096 words x 8 bits per word PROM, T.S.
4096 words x 8 bits per word PROM, T.S.
Case outline
(see 1.2.2)
J
Circuit function
OS
).
Terminals
SIZE
24
24
24
32
28
24
A
Lead finish
(see 1.2.3)
A
REVISION LEVEL
-0.3 to +7.0 V dc
+5.5 V dc
-65C to +150C
+300C
See MIL-STD-1835
-0.3 V dc to V
100 mA
1.04 W dc
+175C
4.5 V dc to 5.5 V dc
2.0 V dc
0.8 V dc
12 mA
-55C to +125C
dual-in-line package
flat package
dual-in-line package
rectangular leadless chip carrier
square leadless chip carrier
flat package
Package style
L
CC
Access time
95 ns
55 ns
45 ns
70 ns
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SHEET
82008
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