RG82845 S L63W Intel, RG82845 S L63W Datasheet - Page 134
![no-image](/images/manufacturer_photos/0/3/336/intel_sml.jpg)
RG82845 S L63W
Manufacturer Part Number
RG82845 S L63W
Description
Manufacturer
Intel
Datasheet
1.RG82845_S_L63W.pdf
(148 pages)
Specifications of RG82845 S L63W
Lead Free Status / RoHS Status
Not Compliant
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Ballout and Package Information
7.1
134
Figure 8. Intel
Package Mechanical Information
This section provides the MCH package mechanical dimensions. The package is a 593 ball
FC-BGA.
®
MCH FC-BGA Package Dimensions (Top and Side View)
33.90
0.600 ±0.100
16.95
Units = M illim eters
9.67
Substrate
0.74 ±0.025
Top View
Side View
37.50
33.90
0.10 ±0.025
36.28
Detail A
Die
Die Solder
Bum ps
Underfill
Epoxy
Intel
16.95
®
See D etail A
82845 MCH for SDR Datasheet
37.50
1.100 ±0.100
0.61
pkg_olga_593_top-side
A
0.152
R
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