STN8810BDS12HPBE STMicroelectronics, STN8810BDS12HPBE Datasheet
STN8810BDS12HPBE
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STN8810BDS12HPBE Summary of contents
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... As a result, the following changes are applicable to the attached document. ● Company name - STMicroelectronics NV is replaced with ST-NXP Wireless. ● Copyright - the copyright notice at the bottom of the last page “© STMicroelectronics 200x - All rights reserved”, shall now read: “© ST-NXP Wireless 200x - All rights reserved”. ● ...
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... Timers controller Watchdog Interrupt controller RTC February 2008 For further information contact your local STMicroelectronics sales office. Description The STn8810S12 is a culmination of breakthroughs in video coding efficiency, inventive algorithms, chip implementation schemes and enhanced packaging techniques. The STn8810S12 system-in-package enables multimedia mobile phones and multimedia portable consumer applications ...
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Contents Contents 1 STn8810S12 general description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Key ...
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... STn8810S12 1 STn8810S12 general description The STn8810S12 system from STMicroelectronics is a culmination of breakthroughs in video coding efficiency, inventive algorithms, chip implementation schemes and enhanced packaging techniques. The processor and memory package enables multimedia mobile phones and multimedia portable consumer applications. The STn8810S12 focuses on the essential features of mobile products and services: a high- performance multimedia capability coupled with low power consumption, based on an open platform strategy ...
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STn8810S12 general description 1.1 Key benefits The STn8810S12 brings the following key benefits to mobile manufacturers and consumers: ● Unsurpassed audio and video quality, ● Ultra-low power consumption for longer battery operation, ● Easier application development for shorter time-to-market, ● ...
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STn8810S12 1.3 Low power consumption The new multimedia functionality of mobile products brings with it an increase in power consumption that is outpacing advances in battery technology. The STn8810S12 saves on power by avoiding the need for high clock speeds ...
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STn8810S12 general description 1.5 STn8810 processor features ● Smart video accelerator – Real-time MPEG4 or H.263 encoding or decoding VGA 30 fps – H.264 encode/decode support – JPEG encode or decode 4080 x 4080 pixels – ...
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STn8810S12 ● I/O peripherals – 3 autobaud UARTs (one with modem control signals 3.692 Mbit/s – One IrDA (SIR/MIR/FIR) interface Mbit/s – One synchronous serial port (SSP Mbit/s – 3 multichannel serial ...
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STn8810S12 general description 1.6 Additional memory devices 1.6.1 1-Gbit NAND Flash memory features ● NAND interface – x16 bus width – Multiplexed address/data – Pinout compatibility for all densities ● Page size – spare) words ● ...
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STn8810S12 1.6.2 512-Mbit DDR mobile RAM features ● Programmable partial array self refresh ● Programmable driver strength ● Auto temperature compensated self refresh by built-in temperature sensor ● Deep power down mode ● Data rate: 266 Mbit/s/IO (max) ● 16-bit ...
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STn8810 architecture overview 2 STn8810 architecture overview The STn8810 platform comprises an industry-standard ARM CPU supported by smart audio and video accelerators, on-chip memory and controllers, a rich set of peripheral interfaces, and a power management system. The processors, controllers, ...
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... NAND Flash device The STn8810S12 contains a 1-Gbit NAND Flash memory (large page). For detailed information on how to use the devices, see the NAND01G-B datasheet which is available from the Internet site http:// www.st.com or from your local STMicroelectronics distributor. Figure 4. NAND Flash logic diagram ...
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Additional memory devices 3.2 DDR mobile RAM device The 512-Mbit DDR mobile RAM is organized as 8,388,608 × 16 bits × 4 banks. It achieves low power consumption and high-speed data transfer using a 2-bit prefetch pipeline architecture. Command and ...
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... ECOPACK® packages. These packages have a lead-free second level interconnect . The category of second level interconnect is marked on the package and on the inner box label, in compliance with JEDEC Standard JESD97. The maximum ratings related to soldering conditions are also marked on the inner box label. ECOPACK is an STMicroelectronics trademark. ECOPACK specifications are available at: www.st.com. Table 1. ...
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Package mechanical data Figure 6. LFBGA 1 288 + 36 +64 - pitch 0.5 package outline Note: The terminal A1 corner is identified on the top surface by using a corner chamfer, ink or ...
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... STn8810S12 5 Ordering information Table 2. Ordering information Order code STN8810BDS12HPBE TFBGA 12x12x1.2 288+36 4R22 0.5 6 Revision history Table 3. Document revision history Date 19-Jan-2007 08-Feb-2008 Package Revision 1 Initial release. 2 Removed all references to SDIO card. Ordering information Packing Tray Changes 15/16 ...
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... Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...