PALCE22V10-25JC Cypress Semiconductor Corp, PALCE22V10-25JC Datasheet - Page 10

• Manufacturer Part Number: PALCE22V10-25JC
• Manufacturer: Cypress Semiconductor Corp

Specifications of PALCE22V10-25JC

• Family Name: Pal®
• Process Technology: EECMOS
• # Macrocells: 10
• # I/os (max): 10
• Frequency (max): 35.7MHz
• Propagation Delay Time: 25ns
• Operating Supply Voltage (typ): 5V
• Operating Supply Voltage (min): 4.75V
• Operating Supply Voltage (max): 5.25V
• Operating Temp Range: 0C to 75C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 28
• Supply Current: 110mA
• Lead Free Status / RoHS Status: Not Compliant

Document #: 38-03027 Rev. *C
Ordering Information
MILITARY SPECIFICATIONS Group A Subgroup
Testing
DC Characteristics
(mA)
130
130
150
120
120
I
90
90
90
CC
(ns)
t
7.5
10
10
15
15
25
25
Parameter
PD
5
V
V
V
I
V
I
OZ
OH
IX
OL
IH
IL
(ns)
10
10
15
15
t
3
5
6
6
S
(ns)
t
15
15
CO
4
5
7
7
8
8
PALCE22V10-5PC
PALCE22V10-5JC
PALCE22V10-7JC
PALCE22V10-7PC
PALCE22V10-10JC
PALCE22V10-10PC
PALCE22V10-10JI
PALCE22V10-10PI
PALCE22V10-10LMB
5962-89841063X
PALCE22V10-10KMB
5962-8984106KX
PALCE22V10-10DMB
5962-8984106LX
PALCE22V10-15JC
PALCE22V10-15PC
PALCE22V10-15KMB
5962-8984102KX
PALCE22V10-15KMB
5962-8984103KX
PALCE22V10-15KMB
5962-8984105KX
PALCE22V10-15DMB
5962-8984102LX
PALCE22V10-15DMB
5962-8984103LX
PALCE22V10-15LMB
5962-89841033X
PALCE22V10-15LMB
5962-89841053X
PALCE22V10-25JC
PALCE22V10-25PC
PALCE22V10-25LMB
5962-89841043X
USE ULTRA37000
ALL NEW DESIGNS
Ordering Code
Subgroups
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
1, 2, 3
TM
Package
FOR
Name
P13
P13
P13
P13
K73
D14
P13
K73
K73
K73
D14
D14
P13
J64
J64
J64
J64
L64
J64
L64
L64
J64
L64
DC Characteristics
Switching Characteristics
24-lead (300 MIL) Molded DIP
28-lead Plastic Leaded Chip Carrier
28-lead Plastic Leaded Chip Carrier
24-lead (300-Mil) Molded DIP
28-lead Plastic Leaded Chip Carrier
24-lead (300-Mil) Molded DIP
28-lead Plastic Leaded Chip Carrier
24-lead (300-Mil) Molded DIP
28-Square Leadless Chip Carrier
24-lead Rectangular Cerpack
24-lead (300 MIL) CerDIP
28-lead Plastic Leaded Chip Carrier
24-lead (300-Mil) Molded DIP
24-lead Rectangular Cerpack
24-lead Rectangular Cerpack
24-lead Rectangular Cerpack
24-lead (300 MIL) CerDIP
24-lead (300 MIL) CerDIP
28-Square Leadless Chip Carrier
28-Square Leadless Chip Carrier
28-lead Plastic Leaded Chip Carrier
24-lead (300-Mil) Molded DIP
28-square Leadless Chip Carrier
Parameter
Parameter
I
t
t
CC
CO
t
PD
t
S
H
Package Type
PALCE22V10
Subgroups
Subgroups
9, 10, 11
9, 10, 11
9, 10, 11
9, 10, 11
1, 2, 3
Commercial
Commercial
Commercial
Industrial
Military
Commercial
Military
Commercial
Military
Page 9 of 13
Operating
Range