TIM7785-4SL Toshiba, TIM7785-4SL Datasheet

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TIM7785-4SL

Manufacturer Part Number
TIM7785-4SL
Description
Manufacturer
Toshiba
Datasheet

Specifications of TIM7785-4SL

Configuration
Single
Gate-source Voltage (max)
5V
Drain-source Volt (max)
15V
Operating Temperature Classification
Military
Mounting
Surface Mount
Pin Count
3
Lead Free Status / RoHS Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
TIM7785-4SL
Manufacturer:
Toshiba
Quantity:
1 400
MICROWAVE SEMICONDUCTOR
TECHNICAL DATA
RF PERFORMANCE SPECIFICATIONS ( Ta= 25 ° C )
Output Power at 1dB Gain
Compression Point
Power Gain at 1dB Gain
Compression Point
Drain Current
Gain Flatness
Power Added Efficiency
3rd Order Intermodulation
Distortion
Drain Current
Channel Temperature Rise
Recommended Gate Resistance(Rg) : 150 Ω (Max.)
Transconductance
Pinch-off Voltage
Saturated Drain Current
Gate-Source Breakdown
Voltage
Thermal Resistance
ELECTRICAL CHARACTERISTICS ( Ta= 25°C )
assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use.
No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others.
The information contained herein is presented only as a guide for the applications of our products. No responsibility is
FEATURES
The information contained herein is subject to change without prior notice. It is therefor advisable to contact TOSHIBA
before proceeding with design of equipment incorporating this product.
LOW INTERMODULATION DISTORTION
HIGH POWER
IM3=-45 dBc at Pout= 25.5dBm
Single Carrier Level
P1dB=36.5dBm at 7.7GHz to 8.5GHz
CHARACTERISTICS
CHARACTERISTICS
SYMBOL
SYMBOL
R
V
V
G
P
ΔTch
I
I
η
I
th(c-c)
IM
GSoff
DS1
DS2
DSS
ΔG
gm
GSO
1dB
1dB
add
3
(VDS X IDS + Pin – P1dB)
V
I
V
I
V
V
I
Channel to Case
(Single Carrier Level)
DS
DS
GS
DS
DS
DS
GS
f = 7.7 to 8.5GHz
Two-Tone Test
CONDITIONS
CONDITIONS
= 1.5A
= 15mA
Po=25.5dBm
= -50mA
= 3V
=
=
= 0V
V
X Rth(c-c)
3V
3V
DS
HIGH GAIN
G1dB=6.5dB at 7.7GHz to 8.5GHz
BROAD BAND INTERNALLY MATCHED FET
HERMETICALLY SEALED PACKAGE
MICROWAVE POWER GaAs FET
= 10V
TIM7785-4SL
UNIT
UNIT
° C/W
dBm
dBc
dB
dB
° C
%
A
A
S
V
A
V
MIN.
35.5
MIN.
-1.0
-42
5.5
-5
TYP. MAX.
36.5
Rev. Jul. 2006
TYP. MAX.
-45
6.5
1.1
1.1
-2.5
900
32
2.6
4.5
±0.8
1.3
1.3
80
-4.0
6.5

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TIM7785-4SL Summary of contents

Page 1

... No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. The information contained herein is subject to change without prior notice therefor advisable to contact TOSHIBA before proceeding with design of equipment incorporating this product. MICROWAVE POWER GaAs FET TIM7785-4SL HIGH GAIN G1dB=6.5dB at 7.7GHz to 8.5GHz BROAD BAND INTERNALLY MATCHED FET ...

Page 2

... CHARACTERISTICS Drain-Source Voltage Gate-Source Voltage Drain Current Total Power Dissipation (Tc= 25 ° C) Channel Temperature Storage Temperature PACKAGE OUTLINE (2-11D1B) HANDLING PRECAUTIONS FOR PACKAGE MODEL Soldering iron should be grounded and the operating time should not exceed 10 seconds at 260°C. TIM7785-4SL SYMBOL UNIT ...

Page 3

... RF PERFORMANCE Output Power (Pout) vs. Frequency VDS=10V IDS≅1.1A 38 Pin=30.0dBm Output Power(Pout) vs. Input Power(Pin) 39 freq.=8.1GHz 38 V =10V DS ≅1. TIM7785-4SL 7.7 8.1 8.3 7.9 Frequency(GHz) Pout ηadd 28 30 Pin(dBm ...

Page 4

... Power Dissipation vs. Case Temperature IM3 vs. Output Power Characteristics -10 V =10V DS ≅1. freq.=8.1GHz -20 Δf=5MHz -30 -40 -50 - Pout(dBm) @Single carrier level TIM7785-4SL (℃ ...

Page 5

... No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. The information contained herein is subject to change without prior notice therefor advisable to contact TOSHIBA before proceeding with design of equipment incorporating this product. MICROWAVE POWER GaAs FET TIM7785-4UL BROAD BAND INTERNALLY MATCHED FET HERMETICALLY SEALED PACKAGE SYMBOL ...

Page 6

... ABSOLUTE MAXIMUM RATINGS ( Ta= 25 ° CHARACTERISTICS Drain-Source Voltage Gate-Source Voltage Drain Current Total Power Dissipation (Tc= 25 ° C) Channel Temperature Storage PACKAGE OUTLINE (2-11D1B) HANDLING PRECAUTIONS FOR PACKAGE MODEL Soldering iron should be grounded and the operating time should not exceed 10 seconds at 260°C. TIM7785-4UL SYMBOL ...

Page 7

... RF PERFORMANCE 10V DS ≅ Pin= 28.0dBm 7.4 7 8.1GHz V = 10V ≅ TIM7785-4UL Output Power vs. Frequency 7.8 8 8.2 Frequency (GHz) Output Power vs. Input Power Po ηadd Pin (dBm) 3 8.4 8.6 8 ...

Page 8

... TIM7785-4UL Power Dissipation vs. Case Temperature (℃) IM3 vs. Output Power Characteristics - 10V DS ≅ 8.1GHz Δ f= 5MHz -30 -40 -50 - Po(dBm), Single Carrier Level ...

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