EMIF02-1003M6 STMicroelectronics, EMIF02-1003M6 Datasheet - Page 7

IC EMI FILTER 2LINE 6-MICRO QFN

EMIF02-1003M6

Manufacturer Part Number
EMIF02-1003M6
Description
IC EMI FILTER 2LINE 6-MICRO QFN
Manufacturer
STMicroelectronics
Series
IPAD™r
Datasheet

Specifications of EMIF02-1003M6

Resistance (ohms)
100
Capacitance
30pF
Tolerance
±10%
Power (watts)
0.063W, 1/16W
Package / Case
6-UQFN, 6-µQFN
Resistance In Ohms
100
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
497-7739-2
EMIF02-1003M6
EMIF02-1003M6
5
5.1
5.2
Recommendation on PCB assembly
Stencil opening design
1.
Figure 13. Stencil opening dimensions
2.
Solder paste
1.
2.
3.
4.
General recommendation on stencil opening design
a)
b)
Reference design
a)
b)
c)
Halide-free flux qualification ROL0 according to ANSI/J-STD-004.
“No clean” solder paste is recommended.
Offers a high tack force to resist component movement during high speed
Solder paste with fine particles: powder particle size is 20-45 µm.
Stencil Opening Dimensions: L (Length), W (Width), T (Thickness).
General Design Rule
Stencil thickness (T) = 75 ~ 125 µm
Stencil opening thickness: 100 µm
Stencil opening for central exposed pad: Opening to footprint ratio is 50%.
Stencil opening for leads: Opening to footprint ratio is 90%.
Aspect Ratio
Aspect Area
=
=
W
---- -
--------------------------- -
2T L
T
L
(
×
1.5
+
W
W
)
L
0.66
T
W
Recommendation on PCB assembly
7/10

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