EMIF02-MIC03M6_11 STMICROELECTRONICS [STMicroelectronics], EMIF02-MIC03M6_11 Datasheet
EMIF02-MIC03M6_11
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EMIF02-MIC03M6_11 Summary of contents
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... Application ■ Mobile phones Description The EMIF02-MIC03M6 is a 2-line highly integrated device designed to suppress EMI/RFI noise in all systems exposed to electromagnetic interference. This filter includes ESD protection circuitry, which prevents damage to the application when subjected to ESD surges all pins. ...
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Characteristics (1) Table 1. Absolute ratings Symbol ESD discharge IEC61000-4-2 contact discharge V PP ESD discharge IEC61000-4-2 air discharge T Junction temperature j T Operating temperature range op T Storage temperature range stg 1. limiting values ...
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Figure 3. S21 attenuation measurement dB 0.00 -5.00 -10.00 -15.00 -20.00 -25.00 -30.00 F (Hz) -35.00 -40.00 300.0k 1.0M 3.0M 10.0M 30.0M 100.0M 300.0M 1.0G Figure 5. ESD response to IEC 61000-4-2 (+8 kV contact discharge) on MIC lines Figure ...
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Ordering information scheme Figure 7. Ordering information scheme EMI Filter Number of lines Information xxx = application zz = version Package Mx = Micro QFN x leads 4/11 EMIF Doc ID 14448 Rev xxx zz Mx ...
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Package information ● Epoxy meets UL94, V0 ● Lead-free packages In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and ...
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Figure 10. Tape and reel specification Dot identifying pin 1 location All dimensions in mm Note: Product marking may be rotated by 90° for assembly plant differentiation case should this product marking be used to orient the component ...
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Recommendation on PCB assembly 4.1 Stencil opening design 1. General recommendation on stencil opening design a) Stencil opening dimensions: L (Length), W (Width), T (Thickness). Figure 11. Stencil opening dimensions b) General design rule Stencil thickness ( ...
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Solder paste 1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004. 2. “No clean” solder paste is recommended. 3. Offers a high tack force to resist component movement during high speed. 4. Solder paste with fine particles: powder particle size ...
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Reflow profile Figure 13. ST ECOPACK® recommended soldering reflow profile for PCB mounting Temperature (°C) Temperature (°C) 260°C max 260°C max 255°C 255°C 220°C 220°C 180°C 180°C 125 °C 125 °C 3°C/s max 3°C/s max ...
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... Ordering information Table 4. Ordering information Order code EMIF02-MIC03M6 1. The marking can be rotated by 90° to differentiate assembly location 6 Revision history Table 5. Document revision history Date 13-Feb-2008 27-May-2011 10/11 Marking Package (1) L Micro QFN Revision 1 Initial release Updated ECOPACK statement. Updated 2 requirements on page 1. Added note Figure 5 ...
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Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any ...