EMIF02-MIC03M6_11 STMICROELECTRONICS [STMicroelectronics], EMIF02-MIC03M6_11 Datasheet - Page 7

• Manufacturer Part Number: EMIF02-MIC03M6_11
• Manufacturer: STMICROELECTRONICS [STMicroelectronics]

4
4.1
Recommendation on PCB assembly
Stencil opening design
1.
Figure 11. Stencil opening dimensions
2.
Figure 12. Recommended stencil window position
General recommendation on stencil opening design
a)
b)
Reference design
a)
b)
Stencil opening dimensions: L (Length), W (Width), T (Thickness).
General design rule
Stencil thickness (T) = 75 ~ 125 µm
Stencil opening thickness: 100 µm
Stencil opening for leads: Opening to footprint ratio is 90%.
Aspect Ratio
7 µm
Aspect Area
236 µm
250 µm
7 µm
=
=
W
---- -
--------------------------- -
2T L
T
Doc ID 14448 Rev 2
15 µm
15 µm
L
≥
(
×
1.5
+
W
W
)
≥
0.66
L
T
W
Footprint
Stencil window
Footprint
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