EMIF02-MIC03M6_11 STMICROELECTRONICS [STMicroelectronics], EMIF02-MIC03M6_11 Datasheet - Page 9
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EMIF02-MIC03M6_11
Manufacturer Part Number
EMIF02-MIC03M6_11
Description
Manufacturer
STMICROELECTRONICS [STMicroelectronics]
Datasheet
1.EMIF02-MIC03M6_11.pdf
(11 pages)
4.5
Note:
Reflow profile
Figure 13. ST ECOPACK® recommended soldering reflow profile for PCB mounting
Minimize air convection currents in the reflow oven to avoid component movement.
Temperature (°C)
Temperature (°C)
260°C max
260°C max
255°C
255°C
125 °C
125 °C
220°C
220°C
180°C
180°C
0
0
0
0
3°C/s max
3°C/s max
1
1
Doc ID 14448 Rev 2
90 to 150 sec
90 to 150 sec
2
2
3
3
4
4
90 sec max
90 sec max
10-30 sec
10-30 sec
5
5
2°C/s recommended
6
6
6°C/s max
2°C/s recommended
6°C/s max
Time (min)
Time (min)
7
7
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