STM32L151RBT6 STMicroelectronics, STM32L151RBT6 Datasheet - Page 61

• Manufacturer Part Number: STM32L151RBT6
• Description: MCU ARM 128KB FLASH 64LQFP
• Manufacturer: STMicroelectronics
• Series: STM32r

Specifications of STM32L151RBT6

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 32MHz
• Connectivity: I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
• Number Of I /o: 51
• Program Memory Size: 128KB (128K x 8)
• Program Memory Type: FLASH
• Eeprom Size: -
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 1.65 V ~ 3.6 V
• Data Converters: A/D 20x12b; D/A 2x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 64-LFQFP
• Processor Series: STM32L151
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 16 KB
• Interface Type: I2C, SPI, USART
• Maximum Clock Frequency: 32 MHz
• Number Of Programmable I/os: 51
• Number Of Timers: 6
• Operating Supply Voltage: 1.8 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Cpu Family: STM32
• Device Core: ARM
• Device Core Size: 32b
• Frequency (max): 32MHz
• Total Internal Ram Size: 16KB
• # I/os (max): 51
• Number Of Timers - General Purpose: 8
• Operating Supply Voltage (typ): 2.5/3.3V
• Operating Supply Voltage (max): 3.6V
• Operating Supply Voltage (min): 1.8V
• On-chip Adc: 20-chx12-bit
• On-chip Dac: 2(2-chx12-bit)
• Instruction Set Architecture: RISC
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 64
• Package Type: LQFP
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 497-11193

STM32L151xx, STM32L152xx
Electrical characteristics
Figure 15. High-speed external clock source AC timing diagram
High-speed external clock generated from a crystal/ceramic resonator
The high-speed external (HSE) clock can be supplied with a 1 to 24 MHz crystal/ceramic
resonator oscillator. All the information given in this paragraph are based on characterization
results obtained with typical external components specified in
Table
24. In the application,
the resonator and the load capacitors have to be placed as close as possible to the oscillator
pins in order to minimize output distortion and startup stabilization time. Refer to the crystal
resonator manufacturer for more details on the resonator characteristics (frequency,
package, accuracy).
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