AD9513BCPZ Analog Devices Inc, AD9513BCPZ Datasheet - Page 22

IC CLOCK DIST 3OUT PLL 32LFCSP

AD9513BCPZ

Manufacturer Part Number
AD9513BCPZ
Description
IC CLOCK DIST 3OUT PLL 32LFCSP
Manufacturer
Analog Devices Inc
Type
Fanout Buffer (Distribution), Dividerr
Datasheet

Specifications of AD9513BCPZ

Number Of Circuits
1
Ratio - Input:output
1:3
Differential - Input:output
Yes/Yes
Input
Differential
Output
CMOS, LVDS
Frequency - Max
800MHz
Voltage - Supply
3.135 V ~ 3.465 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
32-LFCSP
Frequency-max
800MHz
No. Of Multipliers / Dividers
3
No. Of Amplifiers
4
Supply Voltage Range
3.135V To 3.465V
Slew Rate
1V/ns
Operating Temperature Range
-40°C To +85°C
Digital Ic Case Style
LFCSP
Package
32LFCSP EP
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
AD9513/PCBZ - BOARD EVAL CLOCK 3CH AD9513
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant

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AD9513
POWER SUPPLY
The AD9513 requires a 3.3 V ± 5% power supply for V
tables in the Specifications section give the performance
expected from the AD9513 with the power supply voltage
within this range. In no case should the absolute maximum
range of −0.3 V to +3.6 V, with respect to GND, be exceeded
on Pin VS.
Good engineering practice should be followed in the layout of
power supply traces and the ground plane of the PCB. The
power supply should be bypassed on the PCB with adequate
capacitance (>10 μF). The AD9513 should be bypassed with
adequate capacitors (0.1 μF) at all power pins as close as
possible to the part. The layout of the AD9513 evaluation
board (AD9513/PCB) is a good example.
Exposed Metal Paddle
The exposed metal paddle on the AD9513 package is an
electrical connection, as well as a thermal enhancement. For
the device to function properly, the paddle must be properly
attached to ground (GND).
The exposed paddle of the AD9513 package must be soldered
down. The AD9513 must dissipate heat through its exposed
paddle. The PCB acts as a heat sink for the AD9513. The PCB
attachment must provide a good thermal path to a larger heat
dissipation area, such as a ground plane on the PCB. This
requires a grid of vias from the top layer down to the ground
plane (see Figure 28).The AD9513 evaluation board
(AD9513/PCB)provides a good example of how the part
should be attached to the PCB.
Figure 28. PCB Land for Attaching Exposed Paddle
VIAS TO GND PLANE
S
. The
Rev. 0 | Page 22 of 28
POWER MANAGEMENT
In some cases, the AD9513 can be configured to use less power
by turning off functions that are not being used.
The power-saving options include the following:
A divider is powered down when set to divide = 1
(bypassed).
Adjustable delay block on OUT2 is powered down when in
off mode (S0 = 0).
An unneeded output can be powered down (see Table 12).
This also powers down the divider for that output.

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