MC100ES6111AC IDT, Integrated Device Technology Inc, MC100ES6111AC Datasheet - Page 3

• Manufacturer Part Number: MC100ES6111AC
• Description: IC FANOUT BUFFER LV 3GHZ 32-LQFP
• Manufacturer: IDT, Integrated Device Technology Inc
• Type: Fanout Buffer (Distribution), Multiplexerr
• Series: 100ESr

Specifications of MC100ES6111AC

• Number Of Circuits: 1
• Ratio - Input:output: 2:10
• Differential - Input:output: Yes/Yes
• Input: ECL, HSTL, PECL
• Output: ECL, PECL
• Frequency - Max: 3GHz
• Voltage - Supply: 2.375 V ~ 3.465 V
• Operating Temperature: -40°C ~ 110°C
• Mounting Type: Surface Mount
• Package / Case: 32-LQFP
• Frequency-max: 2.7GHz
• Number Of Clock Inputs: 2
• Mode Of Operation: Differential
• Output Frequency: 2700MHz
• Output Logic Level: ECL/PECL
• Operating Supply Voltage (min): -2.375/2.375V
• Operating Supply Voltage (typ): -2.5/-3.3/2.5/3.3V
• Operating Supply Voltage (max): -3.465/3.465V
• Package Type: TQFP
• Operating Temp Range: 0C to 110C
• Operating Temperature Classification: Commercial
• Signal Type: ECL/HSTL/PECL
• Mounting: Surface Mount
• Pin Count: 32
• Quiescent Current: 100mA
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

MPC100ES6111 Data Sheet
MPC100ES6111 REVISION 6 OCTOBER 1, 2009
Table 3. Absolute Maximum Ratings
Table 4. General Specifications
1. Absolute maximum continuous ratings are those maximum values beyond which damage to the device may occur. Exposure to these
1. Output termination voltage V
2. Operating junction temperature impacts device life time. Maximum continuous operating junction temperature should be selected according
Symbol
Symbol
V
T
conditions or conditions beyond those indicated may adversely affect device reliability. Functional operation at absolute-maximum-rated
conditions is not implied.
to the application life time requirements (See application note AN1545 and the application section in this data sheet for more information).
The device AC and DC parameters are specified up to 110°C junction temperature allowing the MC100ES6111 to be used in applications
requiring industrial temperature range. It is recommended that users of the MC100ES6111 employ thermal modeling analysis to assist in
applying the junction temperature specifications to their particular application.
HBM
CDM
I
V
V
MM
V
C
θ
θ
OUT
T
Func
LU
OUT
I
T
CC
IN
JA
JC
TT
IN
IN
S
J
Supply Voltage
DC Input Voltage
DC Output Voltage
DC Input Current
DC Output Current
Storage Temperature
Functional Temperature Range
Output Termination Voltage
ESD Protection (Machine Model)
ESD Protection (Human Body Model)
ESD Protection (Charged Device Model)
Latch-up Immunity
Input Capacitance
Thermal resistance junction to ambient
Thermal Resistance Junction to Case
Operating Junction Temperature
(Continuous Operation)
JESD 51–6, 2S2P multilayer test board
JESD 51–3, single layer test board
Characteristics
Characteristics
TT
= 0 V for V
MTBF = 9.1 years
(1)
CC
(2)
= 2.5 V operation is supported but the power consumption of the device will increase
4000
2000
Min
200
200
T
A
3
–0.3
–0.3
–0.3
Min
–65
= –40
LOW VOLTAGE 2.5V/3.3V DIFFERENTIAL ECL/PECL/HSTL FANOUT BUFFER
V
CC
83.1
73.3
68.9
63.8
57.4
59.0
54.4
52.5
50.4
47.8
23.0
Typ
4.0
– 2
(1)
T
V
V
J
CC
CC
Max
= +110
±20
±50
125
3.6
+ 0.3
+ 0.3
Max
86.0
75.4
70.9
65.3
59.6
60.6
55.7
53.8
51.5
48.8
26.3
110
©2009 Integrated Device Technology, Inc.
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Unit
mA
mA
mA
pF
°C
°C
°C
V
V
V
V
V
V
V
Inputs
Natural convection
100 ft/min
200 ft/min
400 ft/min
800 ft/min
Natural convection
100 ft/min
200 ft/min
400 ft/min
800 ft/min
MIL-SPEC 883E
Method 1012.1
Condition
Condition