AD8389ACPZ Analog Devices Inc, AD8389ACPZ Datasheet - Page 4

• Manufacturer Part Number: AD8389ACPZ
• Description: IC TRPL DELAY LOCK LOOP 48-LFCSP
• Manufacturer: Analog Devices Inc
• Type: Delayed, Locked Loopr

Specifications of AD8389ACPZ

• Frequency: 85MHz
• Voltage - Supply: 3 V ~ 3.6 V
• Current - Supply: 11mA
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 48-LFCSP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Count: -

AD8389
ABSOLUTE MAXIMUM RATINGS
Table 2. AD8389 Stress Ratings
Parameter
Supply Voltages
Input Voltages
Internal Power Dissipation
Operating Temperature Range
Storage Temperature Range
Lead Temperature Range (Soldering 10 sec)
1
2
ESD CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
this product features proprietary ESD protection circuitry, permanent damage may occur on devices
subjected to high energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
Stresses above those listed under the Absolute Maximum Ratings may cause
permanent damage to the device. This is a stress rating only; functional
operation of the device at these or any other conditions above those
indicated in the operational section of this specification is not implied.
Exposure to the absolute maximum ratings for extended periods may
reduce device reliability.
48-Lead LFCSP Package:
AVDDx – AVSSx
DRVDDx – DRVSSx
Maximum Digital Input Voltage
Minimum Digital Input Voltage
LFCSP Package @ T
θ
θ
JA
JC
= 26°C/W (JEDEC Standard 4-layer PCB in still air)
= 20°C/W
A
= 25°C
2
1
Rating
3.9 V
3.9 V
AVDD + 0.3 V
4.8 W
–65°C to +125°C
AVSS – 0.3 V
0°C to 85°C
300°C
Rev. 0 | Page 4 of 12
EXPOSED PADDLE
To ensure high reliability, the exposed paddle must be soldered
to GND.
MAXIMUM POWER DISSIPATION
The maximum power that can be safely dissipated by the
AD8389 is limited by its junction temperature. The maximum
safe junction temperature for plastic encapsulated devices as
determined by the glass transition temperature of the plastic is
approximately 150°C. Exceeding this limit temporarily may
cause a shift in the parametric performance due to a change in
the stresses exerted on the die by the package. Exceeding a
junction temperature of 175°C for an extended period can
result in device failure.
To ensure operation within the specified operating temperature
range, it is necessary to limit the maximum power dissipation as
follows:
5.0
4.5
4.0
3.5
3.0
2.5
2.0
Figure 2. Maximum Power Dissipation vs. Ambient Temperature
25
35
AMBIENT TEMPERATURE (°C)
P
45
DMAX
= (T
55
JMAX
65
– T
A
)/θ
75
JA
85
95