2-487952-8 TE Connectivity, 2-487952-8 Datasheet - Page 2

• Manufacturer Part Number: 2-487952-8
• Description: 028 1MM FPC BTM HORZ
• Manufacturer: TE Connectivity

Specifications of 2-487952-8

• Termination Method To Pc Board: Surface Mount
• Pcb Mounting Orientation: Right Angle
• Pcb Mount Alignment: Without
• Pcb Mount Retention: With
• Actuator Type: Stuffer
• Shrouded: Yes
• Sealed: No
• Strain Relief: Without
• Contact Current Rating, Max (a): 1
• Operating Voltage Reference: AC
• Operating Voltage (vac): 200
• Shielded: No
• Tail Orientation: In-line
• Profile Height (y-axis) (mm [in]): 2.56 [0.1008]
• Centerline (mm [in]): 1.00 [0.039]
• Number Of Positions: 28
• Selectively Loaded: No
• Pcb Mount Retention Type: Solder Pads
• Length (x-axis) (mm [in]): 35.92 [1.4142]
• Width (z-axis) (mm [in]): 6.54 [0.2575]
• Contact Plating, Mating Area, Material: Tin-Lead
• Contact Plating, Mating Area, Thickness (µm [?in]): 0.381 [15]
• Tail Plating Material: Tin-Lead
• Tail Plating, Thickness (µm [?in]): 0.381 [15]
• Contact Design: Single Beam
• Housing Material: Liquid Crystal Polymer (LCP)
• Contact Mating Location: Bottom
• Flex Cable Thickness (mm [in]): 0.3 [0.012]
• Housing Color: Ivory
• Rohs/elv Compliance: Not ELV/RoHS compliant
• Lead Free Solder Processes: Reflow solder capable to 245°C, Reflow solder capable to 260°C
• Circuit Identification Feature: With
• Operating Temperature (°c [°f]): -40 – +85 [-40 – +185]
• Zif/non-zif: ZIF
• Contact Transmits (typical Application): Signal (Data)
• Pick And Place Cover: Without
• Packaging Method: Tape & Reel

3.4.
3.5.
Rev C
Examination of product.
Termination resistance.
Insulation resistance.
Dielectric withstanding voltage.
Solderability.
Vibration, random.
Physical shock.
Durability.
Performance and Test Description
Product is designed to meet the electrical, mechanical and environmental performance requirements
specified in Figure 1. Unless otherwise specified, all tests shall be performed at ambient environmental
conditions per Test Specification 109-1.
Test Requirements and Procedures Summary
Test Description
Meets requirements of product
drawing and AMP Spec 114-1072.
∆R 10 milliohms maximum.
1000 megohms minimum.
500 volts AC at sea level.
Immerse contact tails to within .005
inch of housing. Dipped area shall
have minimum of 95% solder
coverage.
No discontinuities of 1 microsecond
or longer duration.
See Note.
No discontinuities of 1 microsecond
or longer duration.
See Note.
See Note.
Figure 1 (continued)
MECHANICAL
ELECTRICAL
Requirement
Visual, dimensional and functional
per applicable quality inspection
plan.
TE 109-6-1.
Subject mated contacts assembled
in housing to 50 mv maximum open
circuit at 100 ma maximum.
See Figure 3.
TE Spec 109-28-4.
Test between adjacent contacts of
unmated and unmounted samples.
TE Spec 109-29-1.
Test between adjacent contacts of
unmated and unmounted samples.
TE Spec 109-11-5, Test Method B.
Subject contacts to solderability.
TE Spec 109-21-5.
Subject mated samples to 23.91
G's rms. 15 minutes in each of 3
mutually perpendicular planes.
See Figure 4.
TE Spec 109-26-9.
Subject mated samples to 100 G's
sawtooth shock pulses of 6
milliseconds duration. 3 shocks in
each direction applied along 3
mutually perpendicular planes, 18
total shocks.
See Figure 4.
TE Spec 109-27.
Manually mate and unmate
samples for 30 cycles.
Procedure
108-1393
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