HI1-574AKD-5 Intersil, HI1-574AKD-5 Datasheet - Page 17
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HI1-574AKD-5
Manufacturer Part Number
HI1-574AKD-5
Description
IC ADC 12BIT 40KSPS 1CH 28-SBDIP
Manufacturer
Intersil
Datasheet
1.HI3-574AKN-5Z.pdf
(18 pages)
Specifications of HI1-574AKD-5
Number Of Bits
12
Sampling Rate (per Second)
40k
Data Interface
Parallel
Number Of Converters
1
Power Dissipation (max)
720mW
Voltage Supply Source
Dual ±
Operating Temperature
0°C ~ 75°C
Mounting Type
Through Hole
Package / Case
28-CDIP (0.600", 15.24mm)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HI1-574AKD-5
Manufacturer:
Intersil
Quantity:
352
Part Number:
HI1-574AKD-5
Manufacturer:
HAR
Quantity:
20 000
SEATING
Ceramic Dual-In-Line Metal Seal Packages (SBDIP)
NOTES:
10. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
11. Controlling dimension: INCH.
PLANE
PLANE
1. Index area: A notch or a pin one identification mark shall be locat-
2. The maximum limits of lead dimensions b and c or M shall be
3. Dimensions b1 and c1 apply to lead base metal only. Dimension
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
5. Dimension Q shall be measured from the seating plane to the
6. Measure dimension S1 at all four corners.
7. Measure dimension S2 from the top of the ceramic body to the
8. N is the maximum number of terminal positions.
9. Braze fillets shall be concave.
BASE
ccc
S1
b2
ed adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark.
measured at the centroid of the finished lead surfaces, when
solder dip or tin plate lead finish is applied.
M applies to lead plating and finish thickness.
partial lead paddle. For this configuration dimension b3 replaces
dimension b2.
base plane.
nearest metallization or lead.
M
bbb
b
C A - B
S
C A - B
S
A
D
-A-
-B-
A
D
S
e
S
D
17
S
S2
-D-
E
-C-
aaa
Q
M
A
M
e
c1
A/2
L
C A - B
SECTION A-A
LEAD FINISH
METAL
BASE
b1
(b)
S
M
e
HI-574A, HI-674A
c
A
D
S
(c)
D28.6
28 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE
SYMBOL
eA/2
aaa
bbb
ccc
eA
S1
S2
b1
b2
b3
c1
Q
M
A
D
E
α
N
b
c
e
L
MIL-STD-1835 CDIP2-T28 (D-10, CONFIGURATION C)
0.014
0.014
0.045
0.023
0.008
0.008
0.500
0.125
0.015
0.005
0.005
MIN
90
-
-
-
-
-
-
0.100 BSC
0.600 BSC
0.300 BSC
o
INCHES
28
0.232
0.026
0.023
0.065
0.045
0.018
0.015
1.490
0.610
0.200
0.060
0.015
0.030
0.010
0.0015
MAX
105
-
-
o
12.70
0.36
0.36
1.14
0.58
0.20
0.20
3.18
0.38
0.13
0.13
MIN
MILLIMETERS
90
-
-
-
-
-
-
15.24 BSC
o
2.54 BSC
7.62 BSC
28
37.85
15.49
5.92
0.66
0.58
1.65
1.14
0.46
0.38
5.08
1.52
0.38
0.76
0.25
0.038
MAX
105
-
-
Rev. 0 5/18/94
o
August 7, 2008
NOTES
FN3096.6
2
3
4
2
3
5
6
7
2
8
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-
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