X9269TV24IZ-2.7T1 Intersil, X9269TV24IZ-2.7T1 Datasheet - Page 2

• Manufacturer Part Number: X9269TV24IZ-2.7T1
• Description: IC POT XDCP DUAL 50K OHM 24-SOIC
• Manufacturer: Intersil
• Series: XDCP™r

Specifications of X9269TV24IZ-2.7T1

• Taps: 256
• Resistance (ohms): 100K
• Number Of Circuits: 2
• Temperature Coefficient: 300 ppm/°C Typical
• Memory Type: Non-Volatile
• Interface: I²C, 2-Wire Serial
• Voltage - Supply: 2.7 V ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (7.5mm Width)
• Resistance In Ohms: 100K
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

Ordering Information
*Add "T1" suffix for tape and reel.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
X9269TS24*
X9269TS24I*
X9269TS24IZ* (Note)
X9269TS24Z* (Note)
X9269TV24
X9269US24*
X9269US24I*
X9269US24IZ* (Note)
X9269US24Z* (Note)
X9269UV24*
X9269UV24I
X9269TS24-2.7*
X9269TS24I-2.7*
X9269TS24IZ-2.7* (Note)
X9269TS24Z-2.7* (Note)
X9269TV24I-2.7
X9269TV24IZ-2.7* (Note)
X9269US24-2.7*
X9269US24I-2.7*
X9269US24IZ-2.7* (Note)
X9269US24Z-2.7* (Note)
X9269UV24-2.7*
X9269UV24I-2.7*
X9269UV24IZ-2.7*
PART NUMBER
X9269TS
X9269TS I
X9269TS ZI
X9269TS Z
X9269TV
X9269US
X9269US I
X9269US ZI
X9269US Z
X9269UV
X9269UV I
X9269TS F
X9269TS G
X9269TS ZG
X9269TS ZF
X9269TV G
X9269TV ZG
X9269US F
X9269US G
X9269US ZG
X9269US ZF
X9269UV F
X9269UV G
X9269UV ZG
2
MARKING
PART
V
CC
2.7 to 5.5
5 ±10%
(V)
LIMITS
POTENTIOMETER
ORGANIZATION
X9269
(kΩ)
100
100
50
50
-40 to +85 24 Ld SOIC (300 mil)
-40 to +85 24 Ld SOIC (300 mil)
-40 to +85 24 Ld SOIC (300 mil)
-40 to +85 24 Ld SOIC (300 mil)
-40 to +85 24 Ld TSSOP (4.4mm)
-40 to +85 24 Ld SOIC (300 mil)
-40 to +85 24 Ld SOIC (300 mil)
-40 to +85 24 Ld TSSOP (4.4mm)
-40 to +85 24 Ld TSSOP (4.4mm)
-40 to +85 24 Ld SOIC (300 mil)
-40 to +85 24 Ld SOIC (300 mil)
-40 to +85 24 Ld TSSOP (4.4mm)
-40 to +85 24 Ld TSSOP (4.4mm)
RANGE
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
TEMP
(°C)
24 Ld SOIC (300 mil)
(Pb-free)
24 Ld SOIC (300 mil)
(Pb-free)
24 Ld TSSOP (4.4mm)
24 Ld SOIC (300 mil)
(Pb-free)
24 Ld SOIC (300 mil)
(Pb-free)
24 Ld TSSOP (4.4mm)
24 Ld SOIC (300 mil)
(Pb-free)
24 Ld SOIC (300 mil)
(Pb-free)
(Pb-free)
24 Ld SOIC (300 mil)
(Pb-free)
24 Ld SOIC (300 mil)
(Pb-free)
24 Ld TSSOP (4.4mm)
PACKAGE
M24.3
M24.3
M24.3
M24.3
MDP0044
M24.3
M24.3
M24.3
M24.3
MDP0044
MDP0044
M24.3
M24.3
M24.3
M24.3
MDP0044
MDP0044
M24.3
M24.3
M24.3
M24.3
MDP0044
MDP0044
MDP0044
April 17, 2007
DWG. #
PKG.
FN8173.4