X9250TS24I-2.7T2 Intersil, X9250TS24I-2.7T2 Datasheet - Page 2
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X9250TS24I-2.7T2
Manufacturer Part Number
X9250TS24I-2.7T2
Description
IC XDCP QUAD 256-TAP 100K 24SOIC
Manufacturer
Intersil
Series
XDCP™r
Datasheet
1.X9250US24.pdf
(20 pages)
Specifications of X9250TS24I-2.7T2
Taps
256
Resistance (ohms)
100K
Number Of Circuits
4
Temperature Coefficient
300 ppm/°C Typical
Memory Type
Non-Volatile
Interface
SPI, 3-Wire Serial
Voltage - Supply
2.7 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
24-SOIC (7.5mm Width)
Resistance In Ohms
100K
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Ordering Information
*Add "T1" suffix for tape and reel.
NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate
termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL
classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.
X9250TS24I
X9250TS24IZ (Note)
X9250TV24I
X9250TV24IZ (Note)
X9250US24
X9250US24Z (Note)
X9250US24I
X9250US24IZ (Note)
X9250UV24I
X9250UV24IZ (Note)
X9250TS24-2.7
X9250TS24Z-2.7 (Note) X9250TS ZF
X9250TS24I-2.7*
X9250TS24IZ-2.7*
(Note)
X9250TV24I-2.7
X9250TV24IZ-2.7 (Note) X9250TV ZG
X9250US24-2.7*
X9250US24Z-2.7* (Note) X9250US ZF
X9250US24I-2.7
X9250US24IZ-2.7 (Note) X9250US ZG
X9250UV24-2.7
X9250UV24Z-2.7 (Note) X9250UV ZF
X9250UV24I-2.7
X9250UV24IZ-2.7 (Note) X9250UV ZG
PART NUMBER
X9250TS I
X9250TS ZI
X9250TV I
X9250TV ZI
X9250US
X9250US Z
X9250US I
X9250US ZI
X9250UV I
X9250UV ZI
X9250TS F
X9250TS G
X9250TS ZG
X9250TV G
X9250US F
X9250US G
X9250UV F
X9250UV G
MARKING
PART
2
V
CC
-2.7 to 5.5
5 ±10%
LIMITS (V)
ORGANIZATION (kΩ)
POTENTIOMETER
X9250
100
100
50
50
TEMP. RANGE
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
-40 to +85
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
0 to +70
(°C)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil)
(Pb-free)
24 Ld TSSOP
(4.4mm)
24 Ld TSSOP
(4.4mm) (Pb-free)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil)
(Pb-free)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil)
(Pb-free)
24 Ld TSSOP
(4.4mm)
(4.4mm) (Pb-free)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil)
(Pb-free)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil)
(Pb-free)
24 Ld TSSOP
(4.4mm)
24 Ld TSSOP
(4.4mm) (Pb-free)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil)
(Pb-free)
24 Ld SOIC (300 mil)
24 Ld SOIC (300 mil)
(Pb-free)
24 Ld TSSOP
(4.4mm)
(4.4mm) (Pb-free)
24 Ld TSSOP
(4.4mm)
(4.4mm) (Pb-free)
24 Ld TSSOP
24 Ld TSSOP
24 Ld TSSOP
PACKAGE
PKG. DWG. #
M24.3
M24.3
MDP0044
MDP0044
M24.3
M24.3
M24.3
M24.3
MDP0044
MDP0044
M24.3
M24.3
M24.3
MDP0044
MDP0044
M24.3
M24.3
M24.3
M24.3
MDP0044
MDP0044
MDP0044
MDP0044
M24.3
August 29, 2006
FN8165.3