X9409WV24I-2.7T2 Intersil, X9409WV24I-2.7T2 Datasheet - Page 18
![IC XDCP QUAD 64-TAP 10K 24-TSSOP](/photos/6/65/66570/20-24-tssop_sml.jpg)
X9409WV24I-2.7T2
Manufacturer Part Number
X9409WV24I-2.7T2
Description
IC XDCP QUAD 64-TAP 10K 24-TSSOP
Manufacturer
Intersil
Series
XDCP™r
Datasheet
1.X9409WS24ZT1.pdf
(20 pages)
Specifications of X9409WV24I-2.7T2
Taps
64
Resistance (ohms)
10K
Number Of Circuits
4
Temperature Coefficient
300 ppm/°C Typical
Memory Type
Non-Volatile
Interface
I²C, 2-Wire Serial
Voltage - Supply
2.7 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
24-TSSOP
Resistance In Ohms
10K
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
X9409WV24I-2.7T2
Manufacturer:
XICOR
Quantity:
20 000
Small Outline Plastic Packages (SOIC)
NOTES:
10. Controlling dimension: MILLIMETER. Converted inch dimensions
N
1
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
5. The chamfer on the body is optional. If it is not present, a visual index
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
0.25(0.010)
Publication Number 95.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
feature must be located within the crosshatched area.
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
are not necessarily exact.
2
-A-
INDEX
AREA
3
e
B
D
M
C A
SEATING PLANE
M
E
-C-
-B-
B S
A
18
H
A1
0.10(0.004)
0.25(0.010)
α
M
L
h x 45°
B
M
C
X9409
M24.3
24 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
A1
A
B
C
D
E
H
N
α
e
h
L
(JEDEC MS-013-AD ISSUE C)
0.0926
0.0040
0.013
0.0091
0.5985
0.2914
0.394
0.010
0.016
MIN
0°
0.05 BSC
INCHES
24
0.1043
0.0118
0.020
0.0125
0.6141
0.2992
0.419
0.029
0.050
MAX
8°
15.20
10.00
2.35
0.10
0.33
0.23
7.40
0.25
0.40
MILLIMETERS
MIN
0°
1.27 BSC
24
15.60
10.65
MAX
2.65
0.30
0.51
0.32
7.60
0.75
1.27
8°
October 12, 2006
Rev. 1 4/06
NOTES
FN8192.4
9
3
4
5
6
7
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