X9409WV24I-2.7T2 Intersil, X9409WV24I-2.7T2 Datasheet - Page 20
![IC XDCP QUAD 64-TAP 10K 24-TSSOP](/photos/6/65/66570/20-24-tssop_sml.jpg)
X9409WV24I-2.7T2
Manufacturer Part Number
X9409WV24I-2.7T2
Description
IC XDCP QUAD 64-TAP 10K 24-TSSOP
Manufacturer
Intersil
Series
XDCP™r
Datasheet
1.X9409WS24ZT1.pdf
(20 pages)
Specifications of X9409WV24I-2.7T2
Taps
64
Resistance (ohms)
10K
Number Of Circuits
4
Temperature Coefficient
300 ppm/°C Typical
Memory Type
Non-Volatile
Interface
I²C, 2-Wire Serial
Voltage - Supply
2.7 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
24-TSSOP
Resistance In Ohms
10K
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
X9409WV24I-2.7T2
Manufacturer:
XICOR
Quantity:
20 000
Thin Shrink Small Outline Package Family (TSSOP)
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
C
SEATING
PLANE
N LEADS
E
0.10 C
A
0.25
E1
B
c
A2
M
e
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
N
1
C A B
A1
SEE DETAIL “X”
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
TOP VIEW
b
For information regarding Intersil Corporation and its products, see www.intersil.com
DETAIL X
SIDE VIEW
D
END VIEW
20
L1
(N/2)+1
L
(N/2)
0.10
M
0° - 8°
0.05
PIN #1 I.D.
C A B
2X
N/2 LEAD TIPS
A
GAUGE
PLANE
0.20 C
0.25
B A
H
X9409
MDP0044
THIN SHRINK SMALL OUTLINE PACKAGE FAMILY
NOTES:
SYMBOL 14 LD 16 LD 20 LD 24 LD 28 LD TOLERANCE
1. Dimension “D” does not include mold flash, protrusions or gate
2. Dimension “E1” does not include interlead flash or protrusions.
3. Dimensions “D” and “E1” are measured at dAtum Plane H.
4. Dimensioning and tolerancing per ASME Y14.5M-1994.
A1
A2
E1
L1
D
A
b
E
e
L
c
burrs. Mold flash, protrusions or gate burrs shall not exceed
0.15mm per side.
Interlead flash and protrusions shall not exceed 0.25mm per
side.
1.20
0.10
0.90
0.25
0.15
5.00
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
5.00
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
6.50
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
7.80
6.40
4.40
0.65
0.60
1.00
1.20
0.10
0.90
0.25
0.15
9.70
6.40
4.40
0.65
0.60
1.00
+0.05/-0.06
+0.05/-0.06
Rev. E 12/02
October 12, 2006
Reference
±0.05
±0.05
±0.10
±0.10
±0.15
Basic
Basic
Max
FN8192.4