MAX5590BEUG+ Maxim Integrated Products, MAX5590BEUG+ Datasheet - Page 32

IC DAC 12BIT OCTAL BUFF 24-TSSOP

MAX5590BEUG+

Manufacturer Part Number
MAX5590BEUG+
Description
IC DAC 12BIT OCTAL BUFF 24-TSSOP
Manufacturer
Maxim Integrated Products
Datasheet

Specifications of MAX5590BEUG+

Settling Time
3µs
Number Of Bits
12
Data Interface
Serial
Number Of Converters
8
Voltage Supply Source
Analog and Digital
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
24-TSSOP
Resolution
12 bit
Interface Type
Serial (SPI)
Supply Voltage (max)
5.25 V
Supply Voltage (min)
2.7 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Supply Current
3.2 mA
Voltage Reference
External
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Power Dissipation (max)
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Buffered, Fast-Settling, Octal, 12/10/8-Bit,
Voltage-Output DACs
32
MAX5590AEUG+
MAX5590BEUG+
MAX5591AEUI+
MAX5591BEUI+
MAX5592EUG+
MAX5593EUI+
MAX5594EUG+
MAX5595EUI+
______________________________________________________________________________________
PART
TOP VIEW
AGND
OUTC
OUTD
OUTA
OUTB
SCLK
AV
CO NFIGUR ATION
N.C.
N.C.
DSP
DIN
CS
DD
Force Sense
Force Sense
Force Sense
Force Sense
Unity Gain
Unity Gain
Unity Gain
Unity Gain
OUTPUT
BUFFER
10
11
12
1
2
3
4
5
6
7
8
9
+
MAX5590
MAX5592
MAX5594
TSSOP
Selector Guide
R ESO L U TIO N
( B IT S)
24
23
22
21
20
19
18
17
16
15
14
13
12
12
12
12
10
10
8
8
REF
PU
OUTH
N.C.
OUTG
OUTF
OUTE
N.C.
UPIO2
UPIO1
DGND
DV
DD
(LSBs
MAX)
±0.5
±0.5
INL
±1
±4
±1
±4
±1
±1
For the latest package outline information and land patterns, go
to www.maxim-ic.com/packages. Note that a “+”, “#”, or “-” in
the package code indicates RoHS status only. Package draw-
ings may show a different suffix character, but the drawing per-
tains to the package regardless of RoHS status.
PROCESS: BiCMOS
PACKAGE TYPE
24 TSSOP
28 TSSOP
AGND
OUTA
OUTB
OUTC
OUTD
SCLK
AV
DSP
FBC
FBD
FBA
FBB
DIN
CS
DD
10
11
12
13
14
1
2
3
4
5
6
7
8
9
+
MAX5591
MAX5593
MAX5595
TSSOP
PACKAGE CODE
Package Information
U24+1
U28+2
Pin Configurations
Chip Information
28
27
26
25
24
23
22
21
20
19
18
17
16
15
REF
PU
OUTH
FBH
FBG
OUTG
OUTF
FBF
FBE
OUTE
UPIO2
UPIO1
DGND
DV
DD
DOCUMENT NO.
21-0066
21-0066

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