LTC2755CUP-12#TRPBF Linear Technology, LTC2755CUP-12#TRPBF Datasheet - Page 23

• Manufacturer Part Number: LTC2755CUP-12#TRPBF
• Description: IC DAC 12BIT CUR OUT 64-QFN
• Manufacturer: Linear Technology

Specifications of LTC2755CUP-12#TRPBF

• Settling Time: 2µs
• Number Of Bits: 12
• Data Interface: Parallel
• Number Of Converters: 4
• Voltage Supply Source: Single Supply
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 64-QFN
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation (max): -

PACKAGE DESCRIPTION
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION WNJR-5
2. ALL DIMENSIONS ARE IN MILLIMETERS
3. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
4. EXPOSED PAD SHALL BE SOLDER PLATED
5. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE
6. DRAWING NOT TO SCALE
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
PIN 1 TOP MARK
(SEE NOTE 5)
7.15 ±0.05
9 .00 ± 0.10
(4 SIDES)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
7.15 ±0.05
0.50 BSC
0.25 ±0.05
(Reference LTC DWG # 05-08-1705 Rev C)
64-Lead Plastic QFN (9mm × 9mm)
(4 SIDES)
7.50 REF
PACKAGE OUTLINE
0.70 ±0.05
0.75 ± 0.05
UP Package
8.10 ±0.05 9.50 ±0.05
(4-SIDES)
7.50 REF
R = 0.10
0.200 REF
0.00 – 0.05
TYP
7.15 ± 0.10
R = 0.115
BOTTOM VIEW—EXPOSED PAD
TYP
7.15 ± 0.10
CHAMFER
C = 0.35
PIN 1
0.50 BSC
0.25 ± 0.05
LTC2755
(UP64) QFN 0406 REV C
63
64
23
0.40 ± 0.10
1
2
2755f