AD7847BRZ Analog Devices Inc, AD7847BRZ Datasheet - Page 12

• Manufacturer Part Number: AD7847BRZ
• Description: IC DAC 12BIT DUAL MULT 24-SOIC
• Manufacturer: Analog Devices Inc

Specifications of AD7847BRZ

• Data Interface: Parallel
• Settling Time: 4µs
• Number Of Bits: 12
• Number Of Converters: 2
• Voltage Supply Source: Dual ±
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 24-SOIC (7.5mm Width)
• Resolution (bits): 12bit
• Input Channel Type: Parallel
• Supply Voltage Range - Analogue: ± 14.25V To ± 15.75V
• Supply Current: 8mA
• Digital Ic Case Style: SOIC
• No. Of Pins: 24
• Number Of Channels: 2
• Resolution: 12b
• Conversion Rate: 250KSPS
• Interface Type: Parallel
• Single Supply Voltage (typ): Not RequiredV
• Dual Supply Voltage (typ): ±15V
• Architecture: Segment
• Power Supply Requirement: Dual
• Output Type: Voltage
• Integral Nonlinearity Error: ±0.5LSB
• Single Supply Voltage (min): Not RequiredV
• Single Supply Voltage (max): Not RequiredV
• Dual Supply Voltage (min): ±14.25V
• Dual Supply Voltage (max): ±15.75V
• Operating Temp Range: -40C to 85C
• Operating Temperature Classification: Industrial
• Mounting: Surface Mount
• Pin Count: 24
• Package Type: SOIC W
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power Dissipation (max): -
• Lead Free Status / Rohs Status: Compliant

AD7837/AD7847
SEATING
1. LEAD NO. 1 IDENTIFIED BY A DOT OR NOTCH.
2. PLASTIC LEADS WILL EITHER BE SOLDER DIPPED OR TIN LEAD PLATED.
PLANE
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
PIN 1
0.016 (0.41)
0.02 (0.5)
24
1
24-Lead Plastic DIP (N-24)
1.228 (31.19)
1.226 (31.14)
0.11 (2.79)
0.09 (2.28)
0.07 (1.78)
0.05 (1.27)
13
12
AD7837–6502/6809 Interface
Figure 25 shows an interface between the AD7837 and the 6502
or 6809 microprocessor. For the 6502 microprocessor, the φ2
clock is used to generate the WR, while for the 6809 the E sig-
nal is used.
0.01 (0.254)
0.006 (0.15)
0.261
(6.61
PIN 1
0.130 (3.30)
0.128 (3.25)
6502/6809
1. LEAD NO. 1 IDENTIFIED BY A DOT.
2. SOIC LEADS WILL EITHER BE TIN PLATED OR SOLDER DIPPED
24
1
0.001
0.03)
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS.
2 OR E
(1.27)
0.05
R/W
A15
15°
A0
D7
D0
0.32 (8.128)
0°
0.30 (7.62)
0.608 (15.45)
0.596 (15.13)
Dimensions shown in inches and (mm).
0.011 (0.28)
0.009 (0.23)
ADDITIONAL PINS OMITTED FOR CLARITY
OUTLINE DIMENSIONS
0.019 (0.49)
0.014 (0.35)
24-Lead SOIC (R-24)
ADDRESS BUS
SEATING
PLANE
EN
0.096 (2.44)
0.089 (2.26)
ADDRESS
DECODE
13
12
DATA BUS
0.291 (7.39)
0.299 (7.6)
0.225 (5.715)
0.013 (0.32)
0.009 (0.23)
0.125 (3.175)
0.414 (10.52)
0.398 (10.10)
MAX
PIN 1
MIN
1. LEAD NO. 1 IDENTIFIED BY A DOT OR NOTCH.
2. CERDIP LEADS WILL EITHER BE TIN PLATED OR SOLDER DIPPED.
0.021 (0.533)
0.015 (0.381)
IN ACCORDANCE WITH MIL-M-38510 REQUIREMENTS
6
0
TYP
0.03 (0.76)
0.02 (0.51)
24
CS
LDAC
WR
DB7
DB0
1
AD7837
1.290 (32.77) MAX
A0 A1
0.042 (1.067)
0.018 (0.457)
0.110 (2.794)
0.090 (2.286)
24-Lead Cerdip (Q-24)
TYP
0.065 (1.651)
0.055 (1.397)
13
12
0.070 (1.778)
0.020 (0.508)
0.295
(7.493)
MAX
SEATING
PLANE
15°
0.320 (8.128)
0.290 (7.366)
0°
0.012 (0.305)
0.008 (0.203)
TYP
0.180
(4.572)
MAX