JD54LS164BCA National Semiconductor, JD54LS164BCA Datasheet - Page 4

• Manufacturer Part Number: JD54LS164BCA
• Manufacturer: National Semiconductor

Specifications of JD54LS164BCA

• Lead Free Status / Rohs Status: Not Compliant

manufacturer authorized by the qualifying activity for listing on the applicable qualified manufacturers list before contract
award (see 4.3 and 6.4).
herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not
affect the form, fit, or function as described herein.
specified in MIL-PRF-38535 and herein.
figure 1.
qualifying activity and the preparing activity (DSCC-VAS) upon request.
over the full recommended case operating temperature range, unless otherwise specified.
table II. The electrical tests for each subgroup are described in table III.
(see MIL-PRF-38535, appendix A).
modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not effect the
form, fit, or function as described herein.
qualification and quality conformance inspection. The following additional criteria shall apply:
3. REQUIREMENTS
3.1 Qualification. Microcircuits furnished under this specification shall be products that are manufactured by a
3.2 Item requirements. The individual item requirements shall be in accordance with MIL-PRF-38535 and as specified
3.3 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as
3.3.1 Terminal connections and logic diagrams. The terminal connections and logic diagrams shall be as specified on
3.3.2 Truth tables. The truth tables and timing diagrams shall be as specified on figure 2.
3.3.3 Logic diagrams. The logic diagrams shall be as specified on figure 3.
3.3.4 Schematic circuits. The schematic circuits shall be maintained by the manufacturer and made available to the
3.3.5 Case outlines. The case outlines shall be as specified in 1.2.3.
3.4 Lead material and finish. The lead material and finish shall be in accordance with MIL-PRF-38535 (see 6.6).
3.5 Electrical performance characteristics. The electrical performance characteristics are as specified in table I, and apply
3.6 Electrical test requirements. The electrical test requirements for each device class shall be the subgroups specified in
3.7 Marking. Marking shall be in accordance with MIL-PRF-38535.
3.8 Microcircuit group assignment. The devices covered by this specification shall be in microcircuit group number 12
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as
4.2 Screening. Screening shall be in accordance with MIL-PRF-38535 and shall be conducted on all devices prior to
a. The burn-in test duration, test condition, and test temperature, or approved alternatives shall be as specified in the
b. Interim and final electrical test parameters shall be as specified in table II, except interim electrical parameters test
c. Additional screening for space level product shall be as specified in MIL-PRF-38535, appendix B.
device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained
under document control by the device manufacturer's Technology Review Board (TRB) in accordance with MIL-
PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall
specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in
test method 1015 of MIL-STD-883.
prior to burn-in is optional at the discretion of the manufacturer.
MIL-M-38510/306E
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