FWIXP425AC Intel, FWIXP425AC Datasheet - Page 58
FWIXP425AC
Manufacturer Part Number
FWIXP425AC
Description
Manufacturer
Intel
Datasheet
1.FWIXP425AC.pdf
(96 pages)
Specifications of FWIXP425AC
Core Operating Frequency
400MHz
Package Type
BGA
Pin Count
492
Mounting
Surface Mount
Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Not Compliant
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Figure 21.
5.5
Intel
Hardware Design Guidelines
58
®
IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor
Component Placement on a PCB
Stack Up Selection
Stack-up selection directly affects the trace geometry which, in turn, affects the
characteristic impedance requirement for the printed-circuit board. Additionally, the
“clean,” noise-free-planes design and placement is significantly important as
components run at higher speeds requiring more power. Considerations include:
• Place noisy parts (clock, processor, video, etc.) at least 1.5 – 3 inches away from
• Do not place noisy components close to internal/external cables
• Place high-current components near the power sources.
• Do not share the same physical components (buffers, inverters, etc.) between
• Place clock drivers and receivers such that clock trace length is minimized.
• Place clock generation circuits near a ground stitch location. Place a localized
• Install clock circuits directly on the printed circuit board; not on sockets.
• Clock crystals should lie FLAT against the board to provide better coupling of
• Low-speed, printed-circuit-board construction — for example two-layer boards:
the edge of the printed circuit board.
high-speed and low-speed signals. Use separate parts.
ground plane around the clock circuits and connect the localized plane to system
ground plane.
electromagnetic fields to the board.
— they will pick up the noise and radiate
— Be aware of the peak in-rush surge current into the device pins. This surge
— Advantages:
— Disadvantages:
• Inexpensive
• Manufactured by virtually all printed-circuit-board vendors
• Poor routing density
• Uncontrolled signal trace impedance
current may inject high-frequency switching noise into power planes of the
printed circuit board.
PCB
Analog Circuit
Intel
®
IXP42X product line and IXC1100 control plane processors—General PCB Guide
Medium Frequency
High Frequency
Low Frequency
Components
Document Number: 252817-008US
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December 2007
B2264-01
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