FWIXP425AD Intel, FWIXP425AD Datasheet - Page 61
![no-image](/images/manufacturer_photos/0/3/336/intel_sml.jpg)
FWIXP425AD
Manufacturer Part Number
FWIXP425AD
Description
Manufacturer
Intel
Datasheet
1.FWIXP425AD.pdf
(96 pages)
Specifications of FWIXP425AD
Core Operating Frequency
533MHz
Package Type
BGA
Pin Count
492
Mounting
Surface Mount
Operating Temperature (max)
85C
Operating Temperature (min)
-40C
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Not Compliant
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
FWIXP425AD
Manufacturer:
Intel
Quantity:
284
General Layout and Routing Guide—Intel
processors
6.0
6.1
6.2
December 2007
Document Number: 252817-008US
General Layout and Routing Guide
Overview
This chapter provides routing and layout guides for the Intel
Network Processors and IXC1100 Control Plane Processor-based hardware and systems
design.
The high-speed clocking required when designing with the processors requires special
attention to signal integrity. In fact, it is highly recommended that the board design be
simulated to determine optimum layout for signal integrity. The information in this
chapter provides guidelines to aid designers with board layout. In cases where it is too
difficult to follow a design rule, engineering judgment must be used.
Several factors influence the signal integrity of an processors design. These factors
include:
General Layout Guidelines
The layout guidelines recommended in this section are based on the experience and
knowledge gained from the previous projects. The type and number of layers for the
PCB need to be chosen to balance many requirements. That includes the following
requirements as well:
• Power distribution
• Minimizing crosstalk
• 133-MHz SDRAM memory
• Decoupling
• Layout considerations when connecting the processors to the PCI bus
• Providing enough routing channels to support minimum and maximum timing
• Most major critical and important components, connectors, and mounting holes
• Providing uniform impedance for the processors SDRAM-memory bus and other
• Components of same type should be aligned in the same orientation
• Minimizing coupling and crosstalk between networks
• Minimizing RF/EMI and EMC emissions
• Providing stable voltage distribution for each of components
• Decoupling capacitors must be placed next to power pins
• Series termination resistors must be placed close to source
• Silk screen (reference designator) for all parts on both sides: top and bottom
• The trace is X mils wide, with Y mils space between adjacent. It is pitch/width is
• Traces/connections of mixed and analog devices must be physically isolated from
requirements of the IXP42X product line and IXC1100 control plane processors and
other components
must be placed based on product design guidelines and handled with care
signals
greater than 3 (>3)
other components on the board. Component spacing between line-side components
and chassis ground must be adequately provided. No internal ground, power planes
and signal traces are allowed to cross isolation zone. Use appropriate-size PCB
traces for line-side traces and should be larger enough to handle peak current.
Keep away from high-speed digital signals.
Intel
®
®
IXP42X product line and IXC1100 control plane
IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor
®
IXP42X Product Line of
Hardware Design Guidelines
61