EVALADM1065TQEB Analog Devices Inc, EVALADM1065TQEB Datasheet - Page 6

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EVALADM1065TQEB

Manufacturer Part Number
EVALADM1065TQEB
Description
Manufacturer
Analog Devices Inc
Datasheet

Specifications of EVALADM1065TQEB

Lead Free Status / Rohs Status
Not Compliant
ADM1065
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Voltage on VH Pin
Voltage on VPx Pins
Voltage on VXx Pins
Voltage on A0, A1 Pins
Voltage on REFOUT Pin
Voltage on VDDCAP, VCCP Pins
Voltage on PDOx Pins
Voltage on SDA, SCL Pins
Voltage on GND, AGND, PDOGND, REFGND Pins
Input Current at Any Pin
Package Input Current
Maximum Junction Temperature (T
Storage Temperature Range
Lead Temperature,
ESD Rating, All Pins
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Soldering Vapor Phase, 60 sec
J
max)
−0.3 V to +6.5 V
−0.3 V to +0.3 V
±5 mA
±20 mA
−65°C to +150°C
Rating
16 V
7 V
−0.3 V to +7 V
5 V
6.5 V
16 V
7 V
150°C
215°C
2000 V
Rev. C | Page 6 of 28
THERMAL RESISTANCE
soldered in a circuit board for surface-mount packages.
Table 3. Thermal Resistance
Package Type
40-Lead LFCSP
48-Lead TQFP
ESD CAUTION
θ
JA
is specified for the worst-case conditions, that is, a device
θ
25
50
JA
Unit
°C/W
°C/W