MT47H64M16HR-3 IT:HTR Micron Technology Inc, MT47H64M16HR-3 IT:HTR Datasheet - Page 19
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MT47H64M16HR-3 IT:HTR
Manufacturer Part Number
MT47H64M16HR-3 IT:HTR
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Specifications of MT47H64M16HR-3 IT:HTR
Organization
64Mx16
Density
1Gb
Address Bus
16b
Access Time (max)
450ps
Maximum Clock Rate
667MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
135mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Compliant
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Packaging
Package Dimensions
Figure 8: 84-Ball FBGA Package (8mm x 12.5mm) – x16
PDF: 09005aef821ae8bf
1GbDDR2.pdf – Rev. W 7/11 EN
12.5 ±0.1
84X Ø0.45
Dimensions apply
to solder balls
post-reflow on
Ø0.35 SMD ball pads.
11.2 CTR
0.155
0.8 TYP
Notes:
9
1. All dimensions are in millimeters.
2. Solder ball material: SAC305 (96.5% Sn, 3% Ag, 0.5% Cu) or leaded Eutectic (62% Sn,
8
Nonconductive
36%Pb, 2% Ag).
7
overmold
6.4 CTR
1.8 CTR
8 ±0.1
0.8 TYP
3
2
1
B
C
D
E
F
G
H
J
K
L
M
N
P
R
A
19
A
Ball A1 ID
Exposed gold plated pad
1.0 MAX X 0.7 nominal.
Micron Technology, Inc. reserves the right to change products or specifications without notice.
Seating plane
0.12 A
1Gb: x4, x8, x16 DDR2 SDRAM
0.25 MIN
1.1 ±0.1
2007 Micron Technology, Inc. All rights reserved.
Ball A1 ID
Packaging
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