GA355QR7GB103KW01L Murata Electronics, GA355QR7GB103KW01L Datasheet - Page 185

• Manufacturer Part Number: GA355QR7GB103KW01L
• Manufacturer: Murata Electronics

!Note
No.
11 Deflection
12
13 to Soldering
14
15
* "Room condition" Temperature: 15 to 35°C, Relative humidity: 45 to 75%, Atmospheric pressure: 86 to 106kPa
Continued from the preceding page.
Solderability of
Termination
Heat
Temperature
Cycle
Humidity
(Steady
State)
• Please read rating and !CAUTION (for storage, operating, rating, soldering, mounting and handling) in this catalog to prevent smoking and/or burning, etc.
• This catalog has only typical specifi cations. Therefore, please approve our product specifi cations or transact the approval sheet for product specifi cations before ordering.
Item
Appearance
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
Appearance
Capacitance
Change
D.F.
I.R.
Dielectric
Strength
No marking defects
75% of the terminations are to be soldered evenly and continuously.
No marking defects
Within ±10%
0.025 max.
CU0.01μF: More than 100MΩ
CF0.01μF: More than 10,000MΩ
In accordance with item No.4
No marking defects
Within ±7.5%
0.025 max.
CU0.01μF: More than 100MΩ
CF0.01μF: More than 10,000MΩ
In accordance with item No.4
No marking defects
Within ±15%
0.05 max.
CU0.01μF: More than 10MΩ
CF0.01μF: More than 1,000MΩ
In accordance with item No.4
2.0Z1.25
3.2Z1.6
(mm)
LZW
1.2
2.2
a
d
100
b
c
a
Fig. 2
4.0
5.0
b
ø4.5
t : 1.6
1.65
2.0
GR7 Series Specifi cations and Test Methods
c
1.0
d
Solder the capacitor to the testing jig (glass epoxy board) shown
in Fig. 2.
Then apply a force in the direction shown in Fig. 3.
The soldering should be done using the reflow method and
should be conducted with care so that the soldering is uniform
and free of defects such as heat shock.
Immerse the capacitor in a solution of ethanol (JIS-K-8101) and
rosin (JIS-K-5902) (25% rosin in weight proportion).
Immerse in solder solution for 2±0.5 sec.
Immersing speed: 25±2.5mm/s
Temp. of solder: 245±5°C Lead Free Solder (Sn-3.0Ag-0.5Cu)
Preheat the capacitor at 120 to 150°C for 1 min.
Immerse the capacitor in solder solution at 260±5°C for 10±1
sec. Let sit at room condition* for 24±2 hrs., then measure.
Fix the capacitor to the supporting jig (glass epoxy board) shown
in Fig. 4.
Perform the 5 cycles according to the 4 heat treatments listed in
the following table.
Let sit for 24±2 hrs. at room condition,* then measure.
Let the capacitor sit at 40±2°C and relative humidity of 90 to 95%
for 500
Remove and let sit for 24±2 hrs. at room condition,* then
measure.
Perform a heat treatment at 150
let sit for 24±2 hrs. at room condition.*
Perform a heat treatment at 150
let sit for 24±2 hrs. at room condition.*
Perform a heat treatment at 150
let sit for 24±2 hrs. at room condition.*
Step
W24
Y
1
2
3
4
0
hrs.
Max. Operating Temp.±2
Min. Operating Temp.±3
235±5°C H60A or H63A Eutectic Solder
Glass Epoxy Board
Temperature (°C)
: 25±2.5mm/s
R230
Capacitance meter
Room Temp.
Room Temp.
45
Fig. 3
Fig. 4
20 50
45
Pressurize
Continued on the following page.
Pressurizing
speed: 1.0mm/s
W
Y10
W
Y10
W
Y10
0
0
0
Flexure=1
°C for 60±5 min. and then
°C for 60±5 min. and then
°C for 60±5 min. and then
Solder resist
Cu
(in mm)
Time (min.)
2 to 3
2 to 3
30±3
30±3
167
C02E.pdf
Oct.1,2012